Invention Publication
- Patent Title: MULTILAYER ELECTRONIC COMPONENT
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Application No.: US18370201Application Date: 2023-09-19
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Publication No.: US20240186069A1Publication Date: 2024-06-06
- Inventor: Kangha LEE , Jin Soo PARK , Yoona PARK , So Eun CHOI , Eun Byeol CHOI , Chul Seung LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220168650 2022.12.06
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/012 ; H01G4/30
Abstract:
An external electrode of a multilayer electronic component includes a base electrode layer and a corner electrode layer disposed at a corner of a body and disposed on the base electrode layer, wherein an area ratio of metal of the corner electrode layer is 90% or more.
Information query
