MULTILAYER ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20230215653A1

    公开(公告)日:2023-07-06

    申请号:US17890615

    申请日:2022-08-18

    Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.

    MULTILAYER ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20230253156A1

    公开(公告)日:2023-08-10

    申请号:US17893539

    申请日:2022-08-23

    CPC classification number: H01G4/2325 H01G4/30

    Abstract: A multilayer electronic component, may include: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other, the first surface including first and second band electrodes disposed to be spaced apart from each other; a first external electrode disposed on the third surface and connected to the first internal electrode and the first band electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode and the second band electrode; a first plating layer disposed on the first external electrode and the first band electrode; and a second plating layer disposed on the second external electrode and the second band electrode.

    MULTILAYER ELECTRONIC COMPONENT
    4.
    发明公开

    公开(公告)号:US20240177934A1

    公开(公告)日:2024-05-30

    申请号:US18368771

    申请日:2023-09-15

    CPC classification number: H01G4/30 H01G4/008 H01G4/012 H01G4/12

    Abstract: A multilayer electronic component, in which a first external electrode may include a 1-2-th electrode layer including glass, and a 1-3-th electrode layer disposed on the first and second surfaces and a second external electrode may include a 2-2-th electrode layer including glass, and a 2-3-th electrode layer disposed on the first and second surfaces. In cross sections of the first and second external electrodes in the first and second directions, when an area fraction occupied by glass in the 1-2-th electrode layer is S1-2, an area fraction occupied by glass in the 1-3-th electrode layer is S1-3, an area fraction occupied by glass in the 2-2-th electrode layer is S2-2, and an area fraction occupied by glass in the 2-3-th electrode layer is S2-3, S1-2≥15%, S1-2≥S1-3, S2-2≥15%, S2-2>S2-3 are satisfied, thereby preventing cracks and improving moisture resistance reliability.

    MULTILAYER ELECTRONIC COMPONENT
    5.
    发明公开

    公开(公告)号:US20240177933A1

    公开(公告)日:2024-05-30

    申请号:US18375311

    申请日:2023-09-29

    CPC classification number: H01G4/2325 H01G4/30 H01G4/248

    Abstract: A multilayer electronic component, in which the first external electrode may include the 1-1-th electrode layer disposed on the third surface, and the 1-2-th electrode layer disposed on the first and second surfaces, and the second external electrode may include the 2-1-th electrode layer disposed on the fourth surface and the 2-2-th electrode layer disposed on the first and second surfaces, wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu, the contents of the first additive element included in the 1-2-th electrode layer and the 2-2-th electrode layer are greater than the contents of the first additive element included in the 1-1-th electrode layer and the 2-1-th electrode layer, respectively, and the first additive element is at least one selected from Ag and Al, thereby preventing cracks and improving moisture resistance reliability.

    MULTILAYER ELECTRONIC COMPONENT
    6.
    发明公开

    公开(公告)号:US20230253157A1

    公开(公告)日:2023-08-10

    申请号:US17940251

    申请日:2022-09-08

    CPC classification number: H01G4/2325 H01G4/30 H01G4/012

    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and first and second internal electrodes disposed alternately with the dielectric layers in a first direction; a first external electrode including a first connection electrode, disposed on the third surface, and a first band electrode disposed on the first surface to be connected to the first connection electrode; a second external electrode including a second connection electrode, disposed on the fourth surface, and a second band electrode disposed on the first surface to be connected to the second connection electrode; a first insulating layer disposed on the first connection electrode; a second insulating layer disposed on the second connection electrode; a first plating layer disposed on the first band electrode; and a second plating layer disposed on the second band electrode, The first and second band electrodes include a conductive metal and a resin.

    MULTILAYER CAPACITOR
    7.
    发明申请

    公开(公告)号:US20220392707A1

    公开(公告)日:2022-12-08

    申请号:US17733072

    申请日:2022-04-29

    Abstract: A multilayer capacitor includes a capacitor body including an active region having a dielectric layer, and first and second internal electrodes, and an upper cover region and a lower cover region respectively disposed above and below the active region, and including first to sixth surfaces; and first and second external electrodes disposed on both end portions of the capacitor body in the second direction, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes include first and second conductive layers disposed on the third and fourth surfaces, respectively; first and second conductive resin layers disposed on the first and second conductive layers, respectively; and first and second plating layers disposed on the first and second conductive resin layers, respectively, and contacting the first and second conductive layers in the upper or lower cover region, respectively.

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