公开(公告)号：US20240186069A1

公开(公告)日：2024-06-06

申请号：US18370201

申请日：2023-09-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kangha LEE ,  Jin Soo PARK ,  Yoona PARK ,  So Eun CHOI ,  Eun Byeol CHOI ,  Chul Seung LEE

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/012 ,  H01G4/30

Abstract: An external electrode of a multilayer electronic component includes a base electrode layer and a corner electrode layer disposed at a corner of a body and disposed on the base electrode layer, wherein an area ratio of metal of the corner electrode layer is 90% or more.

公开(公告)号：US20250166913A1

公开(公告)日：2025-05-22

申请号：US18907881

申请日：2024-10-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Ah KIM ,  Kang Ha LEE ,  Eun Byeol CHOI ,  Hong Je CHOI ,  Hong Seok KIM ,  Bum Suk KANG

IPC: H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer in a first direction, and external electrodes including band portions disposed on first and second surfaces of the body, connection portions disposed on third and fourth surfaces of the body, and edge portions connecting the band portions and the connection portions and disposed at edges connecting the first and second surfaces and the third and fourth surfaces of the body, wherein the external electrodes includes first external electrode layers connected to the first and second internal electrodes and including first glass, and second external electrode layers disposed on the first external electrode layer of the edge portions and including second glass, and wherein the second glass includes Fe, and the first glass does not include Fe.

公开(公告)号：US20240177933A1

公开(公告)日：2024-05-30

申请号：US18375311

申请日：2023-09-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kangha LEE ,  Yoona PARK ,  So Eun CHOI ,  Eun Byeol CHOI ,  Chul Seung LEE

IPC: H01G4/232 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/30 ,  H01G4/248

Abstract: A multilayer electronic component, in which the first external electrode may include the 1-1-th electrode layer disposed on the third surface, and the 1-2-th electrode layer disposed on the first and second surfaces, and the second external electrode may include the 2-1-th electrode layer disposed on the fourth surface and the 2-2-th electrode layer disposed on the first and second surfaces, wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu, the contents of the first additive element included in the 1-2-th electrode layer and the 2-2-th electrode layer are greater than the contents of the first additive element included in the 1-1-th electrode layer and the 2-1-th electrode layer, respectively, and the first additive element is at least one selected from Ag and Al, thereby preventing cracks and improving moisture resistance reliability.