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公开(公告)号：US20240312718A1
公开(公告)日：2024-09-19
申请号：US18583094
申请日：2024-02-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： So Jung AN , Hyung Jong CHOI , Jung Won PARK , Yoo Jeong LEE , Kwang Yeun WON , Woo Kyung SUNG , Byung Jun JEON , Chul Seung LEE
CPC classification number: H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.
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公开(公告)号：US20240222030A1
公开(公告)日：2024-07-04
申请号：US18372870
申请日：2023-09-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yoo Jeong LEE , Kwang Yeun WON , Hyung Jong CHOI , So Jung AN , Jung Won PARK , Woo Kyung SUNG , Byung Jun JEON , Chul Seung LEE
Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.
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公开(公告)号：US20150318110A1
公开(公告)日：2015-11-05
申请号：US14335674
申请日：2014-07-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jong Ho LEE , Hang Kyu CHO , Doo Young KIM , Chung Eun LEE , Chul Seung LEE
Abstract: A multilayer ceramic electronic component may include: a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on an upper portion of the active part, and a lower cover part disposed on a lower portion thereof; a first dummy electrode disposed between a central portion of the upper or lower cover part in a length direction and one end surface of the cover part in the length direction; and a second dummy electrode disposed between the central portion of the upper or lower cover part in the length direction and the other end surface of the cover part in the length direction, and spaced apart from the first dummy electrode.
Abstract translation: 多层陶瓷电子部件可以包括：陶瓷体，其包括交替设置电介质层和内部电极的有源部，设置在有源部的上部的上盖部，以及设置在下部的下盖部 的; 第一虚拟电极，其设置在长度方向上的上部或下部盖部的中央部与盖部的长度方向的一个端面之间; 以及第二虚拟电极，其设置在长度方向上的上盖部件的中央部分和盖部件的长度方向的另一端面之间，并且与第一虚拟电极间隔开。
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公开(公告)号：US20180082790A1
公开(公告)日：2018-03-22
申请号：US15825857
申请日：2017-11-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Hee HONG , Chul Seung LEE , Won Seh LEE , Doo Young KIM , Chang Hoon KIM , Jae Yeol CHOI , Hyeun Tea YOON
CPC classification number: H01G4/30 , H01G4/0085 , H01G4/1227 , H01G4/232 , H05K3/3442 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked and a margin portion disposed on outer surfaces of the active portion; and external electrodes disposed on outer surfaces of the ceramic body. The margin portion includes an inner half adjacent to the active portion and an outer half adjacent to the edge of the ceramic body, and a porosity of the inner half is greater than a porosity of the outer half.
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公开(公告)号：US20170025222A1
公开(公告)日：2017-01-26
申请号：US15071803
申请日：2016-03-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kum Jin PARK , Chang Hak CHOI , Jong Hoon YOO , Doo Young KIM , Min Gi SIN , Chi Hwa LEE , Chul Seung LEE , Jong Han KIM
Abstract: A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately stacked. The dielectric layers contain at least one dielectric grain having a ratio of a long axis to a short axis that is 3.5 or more. The internal electrodes contain a ceramic component containing a grain growth adjusting ingredient for dielectric grains. Each dielectric layer includes interfacial portions adjacent to the internal electrodes and a central portion disposed between the interfacial portions, and concentrations of the grain growth adjusting ingredient in the interfacial portions and the central portion are different from each other.
Abstract translation: 多层陶瓷电子部件包括其中电介质层和内部电极交替堆叠的陶瓷体。 电介质层含有至少一个长轴与短轴之比为3.5以上的电介质晶粒。 内部电极含有含有电介质晶粒的晶粒生长调节成分的陶瓷成分。 每个电介质层包括与内部电极相邻的界面部分和设置在界面部分之间的中心部分，并且界面部分和中心部分中晶粒生长调节成分的浓度彼此不同。
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Patent Agency Ranking
公开(公告)号：US20160196917A1
公开(公告)日：2016-07-07
申请号：US14857809
申请日：2015-09-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Hyung LIM , Min Hee HONG , Chang Hoon KIM , Doo Young KIM , Chul Seung LEE
Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween, and external electrodes disposed on outer surfaces of the ceramic body. Opposite edge portions of at least one or more of the first and second internal electrodes in a width direction of the ceramic body are thicker than a central portion thereof, and a ratio (T2/T1) of a thickness (T2) of the edge portion to a thickness (T1) of the central portion satisfies 1.0
Abstract translation: 多层陶瓷电子部件包括：陶瓷体，其包括电介质层，第一和第二内部电极，设置成彼此相对设置，各介电层插入其间，外部电极设置在陶瓷体的外表面上。 陶瓷体的宽度方向上的至少一个以上的第一内部电极和第二内部电极的相对的边缘部分比其中心部分厚，并且边缘部分的厚度（T2）的比（T2 / T1） 到中心部分的厚度（T1）满足1.0
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公开(公告)号：US20240203646A1
公开(公告)日：2024-06-20
申请号：US18382204
申请日：2023-10-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Won PARK , Hyung Jong CHOI , So Jung AN , Yoo Jeong LEE , Kwang Yeun WON , Woo Kyung SUNG , Byung Jun JEON , Chul Seung LEE
Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.
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公开(公告)号：US20230230765A1
公开(公告)日：2023-07-20
申请号：US18081079
申请日：2022-12-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Soo PARK , Eui Hyun JO , Jun Hyeong KIM , Ha Jeong KIM , Hyun Hee GU , Woo Kyung SUNG , Myung Jun PARK , Byung Jun JEON , Chul Seung LEE
Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.
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公开(公告)号：US20230162918A1
公开(公告)日：2023-05-25
申请号：US17983117
申请日：2022-11-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Taek Jung LEE , Sang Moon LEE , Chang Ho SEO , Hwi Dae KIM , Chul Seung LEE
CPC classification number: H01G4/1272 , H01G4/012 , H01G4/248 , H01G4/2325 , H01G4/30
Abstract: A multilayer ceramic electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other having the dielectric layer interposed therebetween; and an external electrode disposed externally on the body and connected to one or more of the internal electrodes. The body includes a first region in contact with the external electrode and a second region not in contact with the external electrode, and R1/R2 satisfies 3 to 15 in which R1 indicates a surface roughness Ra of the first region and R2 indicates a surface roughness of the second region.
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公开(公告)号：US20160196918A1
公开(公告)日：2016-07-07
申请号：US14877876
申请日：2015-10-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Hee HONG , Chul Seung LEE , Won Seh LEE , Doo Young KIM , Chang Hoon KIM , Jae Yeol CHOI , Hyeun Tea YOON
CPC classification number: H01G4/30 , H01G4/0085 , H01G4/1227 , H01G4/232 , H05K3/3442 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: A multilayer ceramic capacitor includes a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked and a margin portion disposed on outer surfaces of the active portion; and external electrodes disposed on outer surfaces of the ceramic body. The margin portion includes an inner half adjacent to the active portion and an outer half adjacent to the edge of the ceramic body, and a porosity of the inner half is greater than a porosity of the outer half.
Abstract translation: 多层陶瓷电容器包括：陶瓷体，其包括交替堆叠的包括电介质层和内部电极的有源部分和设置在有源部分的外表面上的边缘部分; 以及设置在陶瓷体的外表面上的外部电极。 边缘部包括与活性部分相邻的内半部和与陶瓷体的边缘相邻的外半部，内半部的孔隙率大于外半部的孔隙率。
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