Invention Publication
- Patent Title: ELECTRICALLY CONDUCTIVE CONTACT PIN AND MANUFACTURING METHOD THEREFOR
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Application No.: US18284524Application Date: 2022-03-22
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Publication No.: US20240192253A1Publication Date: 2024-06-13
- Inventor: Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
- Applicant: POINT ENGINEERING CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Priority: KR 20210041138 2021.03.30
- International Application: PCT/KR2022/003948 2022.03.22
- Date entered country: 2023-09-27
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R1/073
Abstract:
Proposed are an electrically conductive contact pin formed by stacking a plurality of metal layers and a manufacturing method therefor, in which the electrically conductive contact pin has improved physical or electrical characteristics.
Information query
