公开(公告)号：US20240218547A1

公开(公告)日：2024-07-04

申请号：US18558543

申请日：2022-05-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: C25D1/10 ,  C25D5/10 ,  C25D5/48 ,  G03F1/50

CPC classification number: C25D1/10 ,  C25D5/10 ,  C25D5/48 ,  G03F1/50

Abstract: The present disclosure provides a metal structure made from an anodic oxide film and a method of manufacturing the same.

公开(公告)号：US20240183881A1

公开(公告)日：2024-06-06

申请号：US18285384

申请日：2022-04-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/067 ,  G01R3/00

CPC classification number: G01R1/06761 ,  G01R1/06738 ,  G01R3/00

Abstract: The present invention provides an electrically conductive contact pin formed by stacking a plurality of metal layers, and a manufacturing method therefor, the electrically conductive contact pin being pressed by pressing force concentrated at a tip part with a relatively small cross-sectional area, so that unintentional deformation is prevented.

公开(公告)号：US20240055176A1

公开(公告)日：2024-02-15

申请号：US18267098

申请日：2021-12-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01F27/28 ,  H01F27/02

CPC classification number: H01F27/2828 ,  H01F27/02

Abstract: An inductor and a body part for an inductor are proposed. The inductor and the body part satisfy needs for miniaturization and low resistance and increase a value of inductance thereof.

公开(公告)号：US20220359124A1

公开(公告)日：2022-11-10

申请号：US17873020

申请日：2022-07-25

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01G4/40 ,  H01G4/12

Abstract: A multilayer ceramic substrate according to the present invention includes a first insulating portion including a body of a ceramic material, a first via conductor penetrating through the body, and a first internal wiring layer and a first connection pad connected to the first via conductor; and a second insulating portion including a body of an anodized oxide material, a second via conductor penetrating through the body, and a second internal wiring layer and a second connection pad connected to the second via conductor.

公开(公告)号：US20220223754A1

公开(公告)日：2022-07-14

申请号：US17613943

申请日：2020-05-15

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/00 ,  H01L27/15 ,  G09G3/00 ,  H01L33/62 ,  H01L33/38

Abstract: Proposed is a method for manufacturing a micro-LED display, the method including a transfer step of absorbing, by a transfer head, a micro-LED on a first substrate and transferring, by the transfer head, the absorbed micro-LED to a second substrate.

公开(公告)号：US20220076927A1

公开(公告)日：2022-03-10

申请号：US17465856

申请日：2021-09-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Ki Yong PARK

IPC: H01J37/32 ,  C23C4/11

Abstract: Proposed is a part with a corrosion-resistant layer capable of preventing the exposure of pores attributable to corrosion and preventing the discharge of internal moisture and particles through the pores.

公开(公告)号：US20220056606A1

公开(公告)日：2022-02-24

申请号：US17403689

申请日：2021-08-16

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: C25D1/00 ,  G01R1/073 ,  C25D11/04

Abstract: Proposed are an anodic aluminum oxide mold capable of manufacturing a molded article having at least a portion with a dimensional range of several tens of μm, and a mold structure including the same. Additionally, proposed are a method of manufacturing a molded article with a dimensional range of several tens of μm using the anodic aluminum oxide mold, and a molded article manufactured thereby.

公开(公告)号：US20210407830A1

公开(公告)日：2021-12-30

申请号：US17291981

申请日：2019-11-05

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/67 ,  H01L25/075 ,  H01L21/683 ,  H01L21/68

Abstract: Proposed are a micro-LED position error correcting carrier capable of correcting a position error of micro-LEDs, and a micro-LED transfer system using the same. The micro-LED position error correcting carrier includes: a loading recess having a bottom surface and an inclined portion and allowing a micro-LED to be accommodated therein; and a non-loading surface provided around the loading recess.

公开(公告)号：US20210307160A1

公开(公告)日：2021-09-30

申请号：US17209203

申请日：2021-03-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Dong Eun LEE

IPC: H05K1/03 ,  G01R1/073 ,  H05K1/11

Abstract: Proposed are an anodic aluminum oxide structure made of anodic aluminum oxide, a probe head having the same, and a probe card having the same. More particularly, proposed are an anodic aluminum oxide structure that has a fine size and pitch guide hole and facilitates insertion of a probe, a probe head having the same, and a probe card having the same.

公开(公告)号：US20210265522A1

公开(公告)日：2021-08-26

申请号：US17253965

申请日：2020-02-13

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: Proposed are a micro LED transfer method of transferring micro LEDs of a first substrate to a second substrate and a micro LED display device using the same. More particularly, proposed are a micro LED transfer method capable of manufacturing a micro LED display device by transferring a normal individualized module to a second substrate, and a micro LED display device using the same.