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公开(公告)号：US20240218547A1
公开(公告)日：2024-07-04
申请号：US18558543
申请日：2022-05-03
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: The present disclosure provides a metal structure made from an anodic oxide film and a method of manufacturing the same.
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公开(公告)号：US20200335680A1
公开(公告)日：2020-10-22
申请号：US16904102
申请日：2020-06-17
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
IPC: H01L33/62 , H01L25/075 , H01L27/12 , H01L23/00
Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.
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公开(公告)号：US20170162754A1
公开(公告)日：2017-06-08
申请号：US15363261
申请日：2016-11-29
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
IPC: H01L33/48
CPC classification number: H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: A chip substrate includes conductive layers, an insulation layer configured to electrically isolate the conductive layers, and a cavity composed of a groove formed at a predetermined depth in a region including the insulation layer. One side of the cavity includes a first surface and a second surface continuously extending from the first surface, the first surface is formed to vertically extend from a lower portion of the cavity and the second surface is formed so as to have the same slope as the other side of the cavity, whereby the distance between one side of the lower portion of the cavity and the insulation layer is increased.
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公开(公告)号：US20240186116A1
公开(公告)日：2024-06-06
申请号：US18373279
申请日：2023-09-27
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Young Heum EOM , Tae Hwan SONG
IPC: H01J37/32 , C23C16/455 , C25D11/18
CPC classification number: H01J37/3244 , C23C16/45563 , C25D11/18 , H01J2237/3321 , H01J2237/3323
Abstract: Proposed are a metal part used in a display or semiconductor manufacturing process and a process chamber having the part. More particularly, proposed are a metal part that enables a film of uniform thickness to be formed on a surface of a substrate to be processed due to high emissivity thereof, and a process chamber having the same.
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公开(公告)号：US20210302472A1
公开(公告)日：2021-09-30
申请号：US17214785
申请日：2021-03-26
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
IPC: G01R1/073
Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.
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Patent Agency Ranking
公开(公告)号：US20190076854A1
公开(公告)日：2019-03-14
申请号：US15699681
申请日：2017-09-08
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
IPC: B05B1/18 , C25D11/04 , B05B1/00 , C23C16/455
Abstract: A fluid permeable member includes a support body provided in a lower portion thereof with a support plate having a fluid permeable through-hole, and a fluid permeable anodic oxide film disposed on the support plate.
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公开(公告)号：US20250166876A1
公开(公告)日：2025-05-22
申请号：US18840071
申请日：2023-02-16
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: The present invention relates to an inductor and a manufacturing method therefor, and, particularly, the objective of the present invention is to provide an inductor and a manufacturing method therefor, the inductor satisfying needs of small size and low resistance and, simultaneously, having a simplified manufacturing process such that mass production thereof is possible.
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公开(公告)号：US20210337674A1
公开(公告)日：2021-10-28
申请号：US17232750
申请日：2021-04-16
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: Proposed are an anodic aluminum oxide mold made of an anodic aluminum oxide film, a manufacturing method thereof, a half-finished probe product, a manufacturing method thereof, a probe card, and a manufacturing method thereof.
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公开(公告)号：US20210043797A1
公开(公告)日：2021-02-11
申请号：US16534699
申请日：2019-08-07
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
IPC: H01L33/00 , H01L25/075 , H01L33/48 , H01L27/15
Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.
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公开(公告)号：US20200083412A1
公开(公告)日：2020-03-12
申请号：US16563529
申请日：2019-09-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same that facilitate realizing of pixels of the micro LED structure.
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