Invention Publication
- Patent Title: COVER PLATE AND DISPLAY DEVICE
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Application No.: US17908644Application Date: 2021-11-03
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Publication No.: US20240196554A1Publication Date: 2024-06-13
- Inventor: Shaokui LIU , Zhihui WANG , Danping SHEN , Wei ZENG , Qiang TANG
- Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Chengdu, Sichuan
- Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Chengdu, Sichuan
- Priority: CN 2110245878.1 2021.03.05
- International Application: PCT/CN2021/128419 2021.11.03
- Date entered country: 2022-09-01
- Main IPC: H05K5/03
- IPC: H05K5/03 ; B32B7/022 ; B32B7/12 ; B32B27/08 ; B32B27/28 ; B32B27/36 ; B32B27/40

Abstract:
The present disclosure relates to a cover plate and a display device, belonging to the field of displays. The cover plate includes a substrate, a first buffer layer and a second buffer layer. The substrate includes a first surface and a second surface, and the first surface faces a flexible display panel. The first buffer layer is laminated on the first surface, and an elastic modulus of the first buffer layer ranges from 10 MPa to 2 GPa. The second buffer layer is laminated on the second surface, and an elastic modulus of the second buffer layer ranges from 60 MPa to 7 GPa. When the cover plate is impacted, both the first buffer layer and the second buffer layer can deform to absorb stress, so as to protect the substrate, increase the strength of the cover plate, and reduce the possibility of damage to the cover plate. The protection effect of the first buffer layer on the flexible display panel is increased. In addition, the rigidity of the second buffer layer is greater than the rigidity of the first buffer layer, such that second buffer layer has stronger strength. When the cover plate is impacted, the amount of strain transferred to the substrate is reduced, and the possibility of damage to the cover plate is further reduced.
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