Invention Publication
- Patent Title: SENSING DEVICE
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Application No.: US18083447Application Date: 2022-12-16
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Publication No.: US20240197176A1Publication Date: 2024-06-20
- Inventor: Kuei-Hao TSENG , Kai Hung WANG , Kai-Di LU , Yu-Chih LEE , Cheng-Tsao PENG , Pang Yuan LEE
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: A61B5/00
- IPC: A61B5/00 ; H05K1/02
Abstract:
The present disclosure provides a sensing device. The sensing device includes a flexible element having a first sensing area, an electronic component embedded within the flexible element, and an adjustable conductive element disposed in the flexible element and configured to electrically connect the first sensing area of the flexible element with the electronic component.
Information query
