公开(公告)号：US20250080895A1

公开(公告)日：2025-03-06

申请号：US18241206

申请日：2023-08-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kai Hung WANG ,  Kuei-Hao TSENG ,  Chih Lung LIN

IPC: H04R1/10

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element and a deformable element configured to convert energy from one form to make the flexible element compliant with a user's skin.

公开(公告)号：US20240395784A1

公开(公告)日：2024-11-28

申请号：US18202243

申请日：2023-05-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Chih Lung LIN

IPC: H01L25/16 ,  A61B5/256 ,  H01L23/00 ,  H01L23/31

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible carrier, an electronic component disposed over the flexible carrier, and a first flexible connection element configured to connect the flexible carrier and the electronic component. The first flexible connection element is configured to extend along a deformation direction of the electronic device. An interconnection structure is also provided.

公开(公告)号：US20240197176A1

公开(公告)日：2024-06-20

申请号：US18083447

申请日：2022-12-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Kai-Di LU ,  Yu-Chih LEE ,  Cheng-Tsao PENG ,  Pang Yuan LEE

IPC: A61B5/00 ,  H05K1/02

CPC classification number: A61B5/0002 ,  H05K1/0277

Abstract: The present disclosure provides a sensing device. The sensing device includes a flexible element having a first sensing area, an electronic component embedded within the flexible element, and an adjustable conductive element disposed in the flexible element and configured to electrically connect the first sensing area of the flexible element with the electronic component.

公开(公告)号：US20220345812A1

公开(公告)日：2022-10-27

申请号：US17242093

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/24 ,  H04R1/26 ,  G02C11/00

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US20220345811A1

公开(公告)日：2022-10-27

申请号：US17242060

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/26 ,  H04R1/24

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. A location of the first transducer is configured to be adjustable with respect to the second transducer.

公开(公告)号：US20250080894A1

公开(公告)日：2025-03-06

申请号：US18240324

申请日：2023-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Chih Lung LIN

IPC: H04R1/10 ,  H04R1/02

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element having a channel, a first cover at least covering the channel, and a transducing element connected with the flexible element. The transducing element is configured to convert energy from one form to another to deform and affect the flexible element to adjust a dimension of the first cover.

公开(公告)号：US20230199378A1

公开(公告)日：2023-06-22

申请号：US18109792

申请日：2023-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/26 ,  G02C11/00 ,  H04R1/24

CPC classification number: H04R1/403 ,  G02C11/10 ,  H04R1/24 ,  H04R1/26 ,  H04R3/12 ,  H04R2201/401

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US20220346715A1

公开(公告)日：2022-11-03

申请号：US17244876

申请日：2021-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Te Kao TSUI ,  Kai Hung WANG ,  Hung-I LIN

IPC: A61B5/00 ,  H05K1/02

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.