公开(公告)号：US20240197176A1

公开(公告)日：2024-06-20

申请号：US18083447

申请日：2022-12-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Kai-Di LU ,  Yu-Chih LEE ,  Cheng-Tsao PENG ,  Pang Yuan LEE

IPC: A61B5/00 ,  H05K1/02

CPC classification number: A61B5/0002 ,  H05K1/0277

Abstract: The present disclosure provides a sensing device. The sensing device includes a flexible element having a first sensing area, an electronic component embedded within the flexible element, and an adjustable conductive element disposed in the flexible element and configured to electrically connect the first sensing area of the flexible element with the electronic component.

公开(公告)号：US20230017424A1

公开(公告)日：2023-01-19

申请号：US17374748

申请日：2021-07-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pang Yuan LEE ,  Kuei-Hao TSENG ,  Chih Lung LIN

IPC: H01L23/31 ,  H01L23/528

Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.