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公开(公告)号：US20230017424A1
公开(公告)日：2023-01-19
申请号：US17374748
申请日：2021-07-13
发明人： Pang Yuan LEE , Kuei-Hao TSENG , Chih Lung LIN
IPC分类号： H01L23/31 , H01L23/528
摘要： The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.
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2.发明申请公开(公告)号：US20170363682A1
公开(公告)日：2017-12-21
申请号：US15183253
申请日：2016-06-15
发明人： Yu-Jung CHANG , Wei-Kai LIAO , Ming-Ching LIN , Kuei-Hao TSENG
IPC分类号： G01R31/28
CPC分类号： G01R31/2896 , G01R31/046 , G01R31/2853 , G01R31/31715
摘要： A testing system includes a subtractor and a divider. The subtractor is configured to receive a first voltage of a circuit being tested and a second voltage of the circuit, and to derive a difference between the first voltage and the second voltage. The divider is configured to receive the difference between the first voltage and the second voltage, and to derive a resistance of the circuit by dividing (i) the difference between the first voltage and the second voltage by (ii) a difference between a first current applied to the circuit and a second current applied to the circuit. The first voltage is corresponding to the first current, and the second voltage is corresponding to the second current.
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公开(公告)号：US20240197176A1
公开(公告)日：2024-06-20
申请号：US18083447
申请日：2022-12-16
发明人： Kuei-Hao TSENG , Kai Hung WANG , Kai-Di LU , Yu-Chih LEE , Cheng-Tsao PENG , Pang Yuan LEE
CPC分类号： A61B5/0002 , H05K1/0277
摘要： The present disclosure provides a sensing device. The sensing device includes a flexible element having a first sensing area, an electronic component embedded within the flexible element, and an adjustable conductive element disposed in the flexible element and configured to electrically connect the first sensing area of the flexible element with the electronic component.
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公开(公告)号：US20220345812A1
公开(公告)日：2022-10-27
申请号：US17242093
申请日：2021-04-27
发明人： Chih Lung LIN , Kuei-Hao TSENG , Kai Hung WANG
摘要： An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.
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公开(公告)号：US20220345811A1
公开(公告)日：2022-10-27
申请号：US17242060
申请日：2021-04-27
发明人： Chih Lung LIN , Kuei-Hao TSENG , Kai Hung WANG
摘要： An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. A location of the first transducer is configured to be adjustable with respect to the second transducer.
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公开(公告)号：US20230199378A1
公开(公告)日：2023-06-22
申请号：US18109792
申请日：2023-02-14
发明人： Chih Lung LIN , Kuei-Hao TSENG , Kai Hung WANG
摘要： An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.
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公开(公告)号：US20230039552A1
公开(公告)日：2023-02-09
申请号：US17968725
申请日：2022-10-18
发明人： Ming-Tau HUANG , Kuei-Hao TSENG , Hung-I LIN
摘要： A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.
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公开(公告)号：US20220346715A1
公开(公告)日：2022-11-03
申请号：US17244876
申请日：2021-04-29
发明人： Chih Lung LIN , Kuei-Hao TSENG , Te Kao TSUI , Kai Hung WANG , Hung-I LIN
摘要： The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.
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公开(公告)号：US20210037304A1
公开(公告)日：2021-02-04
申请号：US16528338
申请日：2019-07-31
发明人： Ming-Tau HUANG , Kuei-Hao TSENG , Hung-I LIN
摘要： A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.
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