The present application discloses a thermally conductive, electrically insulating film comprising: a thermoplastic resin accounting for 15-50% of the weight of the thermally conductive, electrically insulating film, and a thermally conductive filler accounting for 40-70% of the weight of the thermally conductive, electrically insulating film; wherein the thermally conductive filler comprises: a thermally conductive carbon-based filler, a thermally conductive metal oxide or hydroxide filler and a thermally conductive ceramic filler. The thermally conductive, electrically insulating film is used in electronic products or devices to not only impart excellent heat dissipation capability to electronic products and devices, but also meet the insulativity requirement for electronic products and devices. Meanwhile, such a thermally conductive, electrically insulating film further features excellent flame retardancy and mechanical properties to meet the requirements of the operating environment.