- 专利标题: BACKSIDE ILLUMINATED IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
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申请号: US18656610申请日: 2024-05-07
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公开(公告)号: US20240290815A1公开(公告)日: 2024-08-29
- 发明人: Jun-Ming Su , Chih-Ping Chung , Ming-Yu Ho
- 申请人: Powerchip Semiconductor Manufacturing Corporation
- 申请人地址: TW Hsinchu
- 专利权人: Powerchip Semiconductor Manufacturing Corporation
- 当前专利权人: Powerchip Semiconductor Manufacturing Corporation
- 当前专利权人地址: TW Hsinchu
- 优先权: TW 0128572 2021.08.03
- 分案原申请号: US17458586 2021.08.27
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
A backside illuminated image sensor, including a semiconductor layer, a first gate structure, and a light sensing device, is provided. The semiconductor layer has a first surface and a second surface opposite to each other. The first gate structure is disposed on the second surface. The light sensing device is located in the semiconductor layer. The light sensing device extends from the first surface to the second surface.
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