- 专利标题： Heterogeneous Antenna in Fan-Out Package
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申请号： US18647106申请日： 2024-04-26
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公开(公告)号： US20240297432A1公开(公告)日： 2024-09-05
- 发明人: Po-Yao Chuang , Po-Hao Tsai , Shin-Puu Jeng
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01Q1/22
- IPC分类号： H01Q1/22 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L21/82 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L23/538 ; H01L23/66 ; H01L25/065 ; H01Q9/04 ; H01Q19/10
摘要：
A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure. The redistribution structure includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.
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