- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
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申请号: US18513740申请日: 2023-11-20
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公开(公告)号: US20240313097A1公开(公告)日: 2024-09-19
- 发明人: JUNGGIL YANG , TAEHYUN KIM , TAEWON HA
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR SUWON-SI
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR SUWON-SI
- 优先权: KR 20230035065 2023.03.17
- 主分类号: H01L29/775
- IPC分类号: H01L29/775 ; H01L29/06 ; H01L29/08 ; H01L29/417 ; H01L29/423 ; H01L29/45 ; H01L29/66
摘要:
Disclosed are a semiconductor device and a method of fabricating the same. The semiconductor device includes a substrate including a first region and a second region; an active region on the first region and a peripheral active region on the second region; a channel pattern on the active region; a peripheral channel pattern on the peripheral active region; a first gate electrode on the channel pattern; and a second gate electrode on the peripheral channel pattern. A linewidth of the second gate electrode is larger than a linewidth of the first gate electrode, and a difference in height between the first and second gate electrodes is smaller than about 10 nm, and a top surface of the second gate electrode has a doubly-concave shape.
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