Invention Publication
- Patent Title: MULTI-LEVEL MEMS PROCESS
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Application No.: US18136556Application Date: 2023-04-19
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Publication No.: US20240351864A1Publication Date: 2024-10-24
- Inventor: Roberto Martini , Matthew Julian Thompson , Giacomo Gafforelli , Luca Coronato , Luigi Esposito
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: InvenSense, Inc.
- Current Assignee: InvenSense, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B3/00

Abstract:
An actuator layer of a MEMS sensor is be fabricated to include multi-level features, such as additional sense electrodes, vertical bump stops, or weighted proof masses. A sacrificial layer is deposited on the actuator layer such that locations are provided for the multi-level features to extend vertically from the actuator layer. After the multi-layer features are fabricated on the actuator layer the sacrificial layer is removed. Additional processing such as patterning of the actuator layer may be performed to provide desired functionality and electrical signals to portions of the actuator layer, including to the multi-level features.
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