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公开(公告)号：US20240069061A1
公开(公告)日：2024-02-29
申请号：US18502444
申请日：2023-11-06
申请人： INVENSENSE, INC.
IPC分类号： G01P15/08
CPC分类号： G01P15/08 , G01P2015/0871
摘要： A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
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公开(公告)号：US11548780B2
公开(公告)日：2023-01-10
申请号：US17516245
申请日：2021-11-01
申请人： INVENSENSE, INC.
发明人： David deKoninck , Varun Subramaniam Kumar , Matthew Julian Thompson , Vadim Tsinker , Logeeswaran Veerayah Jayaraman , Sarah Nitzan , Houri Johari-Galle , Jongwoo Shin , Le Jin
摘要： An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
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公开(公告)号：US11186479B2
公开(公告)日：2021-11-30
申请号：US16547257
申请日：2019-08-21
申请人： INVENSENSE, INC.
发明人： David deKoninck , Varun Subramaniam Kumar , Matthew Julian Thompson , Vadim Tsinker , Logeeswaran Veerayah Jayaraman , Sarah Nitzan , Houri Johari-Galle , Jongwoo Shin , Le Jin
摘要： An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
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公开(公告)号：US10793424B2
公开(公告)日：2020-10-06
申请号：US16558145
申请日：2019-09-01
申请人： INVENSENSE, INC.
IPC分类号： B81B7/00 , G01N3/02 , G01M7/08 , G01M17/007 , G01M1/16 , B81B7/02 , B81C99/00 , G06F11/30 , H01L21/66 , H03K21/02
摘要： A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device. In one example, the first MEMS device further comprises a normally open switch that closes when the external influence exceeds the threshold value.
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公开(公告)号：US20200300887A1
公开(公告)日：2020-09-24
申请号：US16824161
申请日：2020-03-19
申请人： INVENSENSE, INC.
IPC分类号： G01P21/00 , G01P15/08 , G01P15/125
摘要： A method of measuring noise of an accelerometer can comprise exposing the accelerometer comprising a micro-electro-mechanical system (MEMS) component coupled to an application specific integrated circuit component (ASIC), to an external environmental input, with the MEMS component being configured to provide a first output to the ASIC based on the external environmental input. The method can further comprise estimating a first noise generated by operation of the MEMS component, and replacing the first output provided to the ASIC from the MEMS component, with a second output generated by a MEMS emulator component, with the second output comprising the first noise. Further, the method can include generating an output of the accelerometer based on the second output processed by the ASIC.
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公开(公告)号：US10393768B2
公开(公告)日：2019-08-27
申请号：US14981877
申请日：2015-12-28
申请人： INVENSENSE, INC.
IPC分类号： G01P15/125 , G01R33/028 , G01P15/12 , G01P15/18 , G01P15/08
摘要： A method and system for a sensor system of a device is disclosed. The sensor system includes a first MEMS sensor (FMEMS), a second MEMS sensor (SMEMS) and a signal processor (SP). An excitation is imparted to the device along a first axis (FA). The FMEMS has a first primary sense axis (FPSA), moves in response to a component of the excitation along the FA aligned with the FPSA and outputs a first signal proportional to an excitation along the FPSA. The SMEMS has a second primary sense axis (SPSA), moves in response to a component of the excitation along the FA aligned with the SPSA and outputs a second signal proportional to an excitation along the SPSA. The SP combines the first signal and the second signal to output a third signal proportional to the excitation along the FA. The FA, the FPSA and the SPSA have different orientations.
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公开(公告)号：US20230365397A1
公开(公告)日：2023-11-16
申请号：US17740832
申请日：2022-05-10
申请人： InvenSense, Inc.
发明人： Mrigank Sharma , Varun Subramaniam Kumar , Luca Coronato , Giacomo Laghi , Matthew Julian Thompson
IPC分类号： B81B3/00
CPC分类号： B81B3/0054 , B81B2201/0235 , B81B2203/0307
摘要： A MEMS sensor includes at least one anchor that extends into a MEMS layer and a proof mass suspended from the at least one anchor. Each anchor is coupled to the proof mass via two compliant springs that are oriented perpendicular to each other and attached to a respective anchor. The compliant springs absorb non-measured external forces such as shear forces that are applied to the sensor packaging, preventing these forces from modifying the relative location and operation of the proof mass.
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公开(公告)号：US11287443B2
公开(公告)日：2022-03-29
申请号：US16794952
申请日：2020-02-19
申请人： INVENSENSE, INC.
摘要： A MEMS accelerometer includes a suspended spring-mass system that has a frequency response to accelerations experienced over a range of frequencies. The components of the suspended spring-mass system such as the proof masses respond to acceleration in a substantially uniform manner at frequencies that fall within a designed bandwidth for the MEMS accelerometer. Digital compensation circuitry compensates for motion of the proof masses outside of the designed bandwidth, such that the functional bandwidth of the MEMS accelerometer is significantly greater than the designed bandwidth.
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公开(公告)号：US11255876B2
公开(公告)日：2022-02-22
申请号：US16824161
申请日：2020-03-19
申请人： INVENSENSE, INC.
IPC分类号： G01P21/00 , G01P15/125 , G01P15/08
摘要： A method of measuring noise of an accelerometer can comprise exposing the accelerometer comprising a micro-electro-mechanical system (MEMS) component coupled to an application specific integrated circuit component (ASIC), to an external environmental input, with the MEMS component being configured to provide a first output to the ASIC based on the external environmental input. The method can further comprise estimating a first noise generated by operation of the MEMS component, and replacing the first output provided to the ASIC from the MEMS component, with a second output generated by a MEMS emulator component, with the second output comprising the first noise. Further, the method can include generating an output of the accelerometer based on the second output processed by the ASIC.
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公开(公告)号：US20210053820A1
公开(公告)日：2021-02-25
申请号：US16547275
申请日：2019-08-21
申请人： INVENSENSE, INC.
IPC分类号： B81B7/00
摘要： A microelectromechanical (MEMS) device may be coupled to a dielectric material at an upper planar surface or lower planar surface of the MEMS device. One or more temperature sensors may be attached to the dielectric material layer. Signals from the one or more temperature sensors may be used to determine a thermal gradient along on axis that is normal to the upper planar surface and the lower planar surface. The thermal gradient may be used to compensate for values measured by the MEMS device.
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