Invention Application
- Patent Title: SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUCTIVE COMPOSITION
-
Application No.: US18682007Application Date: 2022-07-27
-
Publication No.: US20240367270A1Publication Date: 2024-11-07
- Inventor: Hidetsugu NAMIKI , Sarii YAMAGUCHI , Takeshi NISHIO
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tochigi
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tochigi
- Priority: JP2021-138864 20210827
- International Application: PCT/JP2022/028929 WO 20220727
- Main IPC: B23K35/02
- IPC: B23K35/02 ; B22F1/05 ; B22F1/145 ; B23K35/26 ; B23K35/365
Abstract:
Solder particles containing an oxidized film on the surface thereof, wherein the average film thickness of the oxidized film is 3 nm or greater, and the average surface roughness Ra of the solder particles is 10 nm or greater are provided.
Information query
