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公开(公告)号：US20250128361A1
公开(公告)日：2025-04-24
申请号：US18688455
申请日：2022-08-05
Applicant: DEXERIALS CORPORATION
Inventor： Sarii YAMAGUCHI , Hidetsugu NAMIKI , Takeshi NISHIO
Abstract: A solder particle manufacturing method includes a curing step of curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm2 or greater and 1,500 N/mm2 or less, and a classifying step of classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.
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公开(公告)号：US20250001528A1
公开(公告)日：2025-01-02
申请号：US18709619
申请日：2022-10-25
Applicant: DEXERIALS CORPORATION
Inventor： Hidetsugu NAMIKI , Sarii YAMAGUCHI , Takeshi NISHIO
Abstract: Solder particles include composite solder particles at a percentage of 5% by number or less in a total of the solder particles, the composite solder particles including multiple adhered solder particles. A solder particle production method includes an impact force application step of applying an impact force to solder particles so that a percentage of composite solder particles becomes 5% 10 by number or less in a total of the solder particles, the composite solder particles including multiple adhered solder particles.
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公开(公告)号：US20240367270A1
公开(公告)日：2024-11-07
申请号：US18682007
申请日：2022-07-27
Applicant: DEXERIALS CORPORATION
Inventor： Hidetsugu NAMIKI , Sarii YAMAGUCHI , Takeshi NISHIO
IPC: B23K35/02 , B22F1/05 , B22F1/145 , B23K35/26 , B23K35/365
Abstract: Solder particles containing an oxidized film on the surface thereof, wherein the average film thickness of the oxidized film is 3 nm or greater, and the average surface roughness Ra of the solder particles is 10 nm or greater are provided.
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