公开(公告)号：US20250128361A1

公开(公告)日：2025-04-24

申请号：US18688455

申请日：2022-08-05

Applicant: DEXERIALS CORPORATION

Inventor： Sarii YAMAGUCHI ,  Hidetsugu NAMIKI ,  Takeshi NISHIO

IPC: B23K35/02 ,  B23K35/26

Abstract: A solder particle manufacturing method includes a curing step of curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm2 or greater and 1,500 N/mm2 or less, and a classifying step of classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.

公开(公告)号：US20250122316A1

公开(公告)日：2025-04-17

申请号：US18574456

申请日：2022-06-30

Applicant: DEXERIALS CORPORATION

Inventor： Shunsuke TSUDA ,  Takeshi NISHIO

IPC: C08F122/14 ,  C08F2/30 ,  C08F2/44 ,  C08F120/68 ,  C08F222/10 ,  C08K5/00 ,  C08K5/5415 ,  C08K5/55 ,  C08L35/00

Abstract: A curable composition that includes a polymerizable monomer, an aluminum chelate compound, a silanol compound, and a quaternary boron-containing onium salt.

公开(公告)号：US20250001528A1

公开(公告)日：2025-01-02

申请号：US18709619

申请日：2022-10-25

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Sarii YAMAGUCHI ,  Takeshi NISHIO

IPC: B23K35/02 ,  B22F1/17 ,  B23K35/26 ,  C22C12/00

Abstract: Solder particles include composite solder particles at a percentage of 5% by number or less in a total of the solder particles, the composite solder particles including multiple adhered solder particles. A solder particle production method includes an impact force application step of applying an impact force to solder particles so that a percentage of composite solder particles becomes 5% 10 by number or less in a total of the solder particles, the composite solder particles including multiple adhered solder particles.

公开(公告)号：US20230279217A1

公开(公告)日：2023-09-07

申请号：US18007335

申请日：2022-02-02

Applicant: DEXERIALS CORPORATION

Inventor： Takeshi NISHIO ,  Shunsuke TSUDA ,  Kazunobu KAMIYA

IPC: C08L63/00 ,  C08G59/24 ,  C08G59/06 ,  C08G59/70

CPC classification number: C08L63/00 ,  C08G59/24 ,  C08G59/06 ,  C08G59/70

Abstract: Provided is a cationic curing agent including porous particles and a mixture carried on the porous particles. The mixture includes a compound represented by Formula (1) below in which R1 to R3 are identical and R1 to R6 are identical and a compound represented by Formula (1) below in which at least one of R1 to R6 is different.




In Formula (1), R1 to R3 are each an optionally branched alkyl group having from 1 to 18 carbon atoms, or a phenyl group that may have a substituent, and R4 to R6 are each a hydrogen atom, an optionally branched alkyl group having from 1 to 4 carbon atoms, a halogenoalkyl group, an alkoxy group, or a phenoxy group that may have a substituent.

公开(公告)号：US20230015183A1

公开(公告)日：2023-01-19

申请号：US17905265

申请日：2021-02-26

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Takeshi NISHIO ,  Yasumasa SHIN ,  Daiki NODA

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: A repairing component including a micro-LED chip including an electrode and having an electrode plane on which the electrode is disposed, and an anisotropic conductive layer disposed to be in contact with the electrode disposed on the electrode plane of the micro-LED chip, where the anisotropic conductive layer has an area matching with an area of the electrode plane.

公开(公告)号：US20240384147A1

公开(公告)日：2024-11-21

申请号：US18690044

申请日：2022-08-22

Applicant: DEXERIALS CORPORATION

Inventor： Yijing ZHAO ,  Hiroki SHIBUYA ,  Yuki IWATA ,  Takeshi NISHIO ,  Makoto INOUE ,  Ryoko KAWAKAMI

IPC: C09K5/14 ,  C08G65/26 ,  C08J5/18 ,  C08K3/08 ,  C08K9/02

Abstract: A thermally conductive composition including a curable component, a curing agent configured to cure the curable component, and a metallic filler is provided. The metallic filler contains thermally conductive particles and low-melting-point metallic particles. A volume average particle diameter of the thermally conductive particles is greater than a volume average particle diameter of the low-melting-point metallic particles. A melting point of the low-melting-point metallic particles is lower than a thermal curing treatment temperature of the thermally conductive composition.

公开(公告)号：US20240367270A1

公开(公告)日：2024-11-07

申请号：US18682007

申请日：2022-07-27

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Sarii YAMAGUCHI ,  Takeshi NISHIO

IPC: B23K35/02 ,  B22F1/05 ,  B22F1/145 ,  B23K35/26 ,  B23K35/365

Abstract: Solder particles containing an oxidized film on the surface thereof, wherein the average film thickness of the oxidized film is 3 nm or greater, and the average surface roughness Ra of the solder particles is 10 nm or greater are provided.

公开(公告)号：US20240266086A1

公开(公告)日：2024-08-08

申请号：US18018796

申请日：2021-07-12

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Kaori WAKU ,  Takeshi NISHIO ,  Yusuke TANAKA ,  Shoko KUGA

IPC: H01B1/22 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36

CPC classification number: H01B1/22 ,  B23K35/0244 ,  B23K35/3613 ,  B23K35/302 ,  B23K35/3033

Abstract: A composite conductive particles capable of suppressing cracking and peeling of metal films to provide excellent adhesion of metal films, and a method for manufacturing a composite conductive particle. The composite conductive particle includes a host particle; and adhesive fine particles arranged on a surface of the host particle and containing oxygen atoms; and conductive fine particles in contact with the adhesive fine particle. By arranging adhesive fine particles containing oxygen atoms on the surface of the host particle and bringing the conductive fine particles into contact with the adhesive fine particles, it is possible to achieve excellent adhesion of the metal film.

公开(公告)号：US20220298297A1

公开(公告)日：2022-09-22

申请号：US17636499

申请日：2020-08-18

Applicant: DEXERIALS CORPORATION

Inventor： Takeshi NISHIO ,  Kazunobu Kamiya

IPC: C08G59/68 ,  C08K5/12

Abstract: A cationic curing agent includes porous particles and a compound represented by General Formula (1), where the compound is held in the porous particles. In the General Formula (1), R1 is an alkyl group having 1 to 18 carbon atoms or a phenyl group, where the alkyl group may be branched and the alkyl group and the phenyl group may each further have a substituent. R2 is a hydrogen atom, an alkyl group having 1 to 4 carbon atoms where the alkyl group may be branched, a halogenoalkyl group, an alkoxy group, or a phenoxy group; where the alkyl group, the halogenoalkyl group, the alkoxy group, or the phenoxy group may further have a substituent. R1 and R2 may be identical to or different from each other.