Invention Application
- Patent Title: Thick Film Single Layer Capacitor
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Application No.: US18632390Application Date: 2024-04-11
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Publication No.: US20240379649A1Publication Date: 2024-11-14
- Inventor: Cory Nelson , Marianne Berolini , Jessica Parry , Jonathan Shealy
- Applicant: KYOCERA AVX Components Corporation
- Applicant Address: US SC Fountain Inn
- Assignee: KYOCERA AVX Components Corporation
- Current Assignee: KYOCERA AVX Components Corporation
- Current Assignee Address: US SC Fountain Inn
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L21/48 ; H05K1/11 ; H05K1/16

Abstract:
Single layer capacitors and circuit boards having such capacitors are provided. A circuit board can include a circuit board substrate having a mounting surface and a single layer capacitor at least partially embedded therein. The single layer capacitor includes a first conductive layer formed over at least a portion of a substrate first surface and a second conductive layer formed over at least a portion of a substrate second surface. At least one of the first or second conductive layers has a thickness that is at least about 5 microns. A method of forming a single layer capacitor includes depositing a first conductive layer over at least a portion of a substrate first surface and depositing a second conductive layer over at least a portion of a substrate second surface. At least one of the first or second conductive layers has a thickness that is at least about 5 microns.
Information query
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