公开(公告)号：US20240379649A1

公开(公告)日：2024-11-14

申请号：US18632390

申请日：2024-04-11

Applicant: KYOCERA AVX Components Corporation

Inventor： Cory Nelson ,  Marianne Berolini ,  Jessica Parry ,  Jonathan Shealy

IPC: H01L27/01 ,  H01L21/48 ,  H05K1/11 ,  H05K1/16

Abstract: Single layer capacitors and circuit boards having such capacitors are provided. A circuit board can include a circuit board substrate having a mounting surface and a single layer capacitor at least partially embedded therein. The single layer capacitor includes a first conductive layer formed over at least a portion of a substrate first surface and a second conductive layer formed over at least a portion of a substrate second surface. At least one of the first or second conductive layers has a thickness that is at least about 5 microns. A method of forming a single layer capacitor includes depositing a first conductive layer over at least a portion of a substrate first surface and depositing a second conductive layer over at least a portion of a substrate second surface. At least one of the first or second conductive layers has a thickness that is at least about 5 microns.

公开(公告)号：US20240381537A1

公开(公告)日：2024-11-14

申请号：US18632413

申请日：2024-04-11

Applicant: KYOCERA AVX Components Corporation

Inventor： Cory Nelson ,  Jessica Parry

IPC: H05K1/18

Abstract: Single layer capacitors and circuit boards are provided. A circuit board can include a circuit board substrate having a mounting surface and a single layer capacitor at least partially embedded within the circuit board substrate. The single layer capacitor can include a first passivation layer formed over at least a portion of a first surface of a substrate, a first conductive layer formed over at least a portion of the first passivation layer, and a second conductive layer formed over at least a portion of a second surface of the substrate. A method for forming a single layer capacitor can include depositing a passivation layer over at least a portion of a substrate first surface, depositing a first conductive layer over at least a portion of the passivation layer, and depositing a second conductive layer over at least a portion of a substrate second surface, opposite the first surface.