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1.发明申请公开(公告)号：US20250167414A1
公开(公告)日：2025-05-22
申请号：US18944054
申请日：2024-11-12
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Marianne Berolini , Jonathan Herr
Abstract: Filters, filter assemblies, and methods of forming filters are provided. For example, a filter includes a plurality of dielectric layers that are stacked in a Z-direction to form a substrate having a top, a bottom, and a perimeter, with an outer dielectric layer disposed at the top. The filter also includes a plurality of conductive layers, with an outer conductive layer formed over the outer dielectric layer, and a plurality of vias that are defined along the perimeter of the substrate and extend from the outer conductive layer to the bottom of the substrate. An assembly includes the filter attached to a device substrate. A method of forming the filter includes forming the dielectric and conductive layers, such as by forming an outer conductive layer over an outer dielectric layer; stacking the plurality of layers to form a substrate; and defining a plurality of vias along the substrate's perimeter.
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公开(公告)号：US20240250113A1
公开(公告)日：2024-07-25
申请号：US18609003
申请日：2024-03-19
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Gheorghe Korony
IPC: H01L23/367 , H01L23/64 , H01L23/66
CPC classification number: H01L28/20 , H01L23/367 , H01L23/647 , H01L23/66
Abstract: A surface mount component is disclosed including an electrically insulating beam that is thermally conductive. The electrically insulating beam has a first end and a second end that is opposite the first end. The surface mount component includes a thin-film component formed on the electrically insulating beam adjacent the first end of the electrically insulating beam. A heat sink terminal is formed on the electrically insulating beam adjacent a second end of the electrically insulating beam. In some embodiments, the thin-film component has an area power capacity of greater than about 0.17 W/mm2 at about 28 GHz.
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公开(公告)号：US11949169B2
公开(公告)日：2024-04-02
申请号：US17676889
申请日：2022-02-22
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Gheorghe Korony
CPC classification number: H01Q5/314 , H01L27/08 , H01L28/20 , H01Q1/2283
Abstract: A resistive splitter can include a monolithic substrate and a patterned resistive layer formed over the monolithic substrate. The resistive splitter can include a first terminal, a second terminal, and a third terminal each connected with the patterned resistive layer. The resistive splitter can include at least one frequency compensating conductive layer formed over a portion of the patterned resistive layer. In some embodiments, the resistive splitter can exhibit a first insertion loss response between the first terminal and the second terminal that is greater than about −10 dB for frequencies ranging from about 0 GHz up to about 30 GHz.
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公开(公告)号：US20230076503A1
公开(公告)日：2023-03-09
申请号：US17891193
申请日：2022-08-19
Applicant: KYOCERA AVX Components Corporation
Inventor： Marianne Berolini , Cory Nelson , Ronald S. Demcko
Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a first end of the body. At least one second terminal formed over a second end of the body. The second end of the body can be opposite the first end of the body in an X-direction. The heat sink component can have a length in the X-direction and a width in a Y-direction that is parallel with the top surface and perpendicular to the X-direction. A ratio of the width to the length can be greater than about 1.
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5.发明申请公开(公告)号：US20220352391A1
公开(公告)日：2022-11-03
申请号：US17722465
申请日：2022-04-18
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson
Abstract: A metal-oxide-semiconductor (MOS) capacitor can include a substrate including a semiconductor material, an oxide layer formed on a surface of the substrate, a conductive layer formed over at least a portion of the oxide layer, a first terminal connected with the surface of the substrate, and a second terminal connected with the conductive layer. The oxide layer can be connected in series between the substrate and the conductive layer to form a capacitor between the first terminal and the second terminal. Each of the first terminal and the second terminal can be exposed along the surface of the substrate for surface mounting the capacitor. The MOS capacitor can exhibit excellent high frequency performance. For example, an insertion loss of the MOS capacitor can be greater than about −0.75 dB for frequencies ranging from about 5 GHz to about 40 GHz.
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Patent Agency Ranking
公开(公告)号：US20250079321A1
公开(公告)日：2025-03-06
申请号：US18805598
申请日：2024-08-15
Applicant: KYOCERA AVX Components Corporation
Inventor： Jonathan Herr , Cory Nelson , Marianne Berolini , Joseph Hock
IPC: H01L23/538 , H01L23/00 , H01L23/48 , H01L25/00 , H01L25/065
Abstract: Vertically oriented interposer stacks, assemblies, and methods are provided. For example, a vertically oriented interposer stack includes a plurality of interposers and a plurality of components. Each component is disposed between adjacent interposers. Each interposer includes a first side surface opposite a second side surface along the vertical direction. The first side surface and the second side surface each extend along the longitudinal direction from a first end surface to a second end surface. Each interposer has a first external termination formed on the first side surface and a second external termination formed on the first side surface. The first and second external terminations are spaced apart along the longitudinal direction. The interposers are stacked along the lateral direction such that the first external terminations are generally aligned with one another along the lateral direction and the second external terminations are generally aligned with one another along the lateral direction.
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7.发明授权公开(公告)号：US12200853B2
公开(公告)日：2025-01-14
申请号：US17849841
申请日：2022-06-27
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Jeff Borgman , Marianne Berolini
Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.
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公开(公告)号：US20240314928A1
公开(公告)日：2024-09-19
申请号：US18581441
申请日：2024-02-20
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Ronald Demcko , Jeff Borgman
CPC classification number: H05K1/111 , H01P1/20 , H05K1/0237 , H05K1/181 , H05K3/0047 , H05K3/0064 , H05K3/0067 , H05K3/403 , H05K2201/09181 , H05K2201/09981 , H05K2201/1006 , H05K2203/025 , H05K2203/1461
Abstract: Components, methods of forming components, and methods of assembling components on an electronic device are provided. For example, a method of forming a component includes providing a first substrate having a first surface, a second surface opposite the first surface along a height direction, and an initial thickness from the first surface to the second surface along the height direction; forming one or more vias in the first substrate, each via extending from the first surface to the second surface of the first substrate; depositing one or more conductive pathways on the first surface of the first substrate; plating the one or more vias; disposing a second substrate on the first surface of the first substrate to form a component sandwich; processing the second surface of the first substrate to reduce a thickness of the component sandwich; and forming one or more contact pads on the first substrate.
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公开(公告)号：US20240292540A1
公开(公告)日：2024-08-29
申请号：US18582750
申请日：2024-02-21
Applicant: KYOCERA AVX Components Corporation
Inventor： Ronald Demcko , Cory Nelson , Marianne Berolini
CPC classification number: H05K1/18 , H05K1/0203 , H05K2201/066 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10189 , H05K2201/10393 , H05K2201/10522 , H05K2201/1053
Abstract: The present disclosure provides multicomponent connector assemblies and methods of forming such assemblies. For example, a multicomponent connector assembly includes a multicomponent connector having first and support members and also includes a plurality of components disposed between the first and second support members. At least one of the plurality of components may be a heat sink component configured to conduct heat from a first area to a second area. Additionally, or alternatively, the plurality of components may include a capacitor, a resistor, a varistor, an inductor, or the like. In at least some connectors, a plurality of slots are defined, and at least one component is disposed between the first and support members in a respective one slot of the plurality of slots.
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公开(公告)号：US20240136448A1
公开(公告)日：2024-04-25
申请号：US18489042
申请日：2023-10-17
Applicant: KYOCERA AVX Components Corporation
Inventor： Ronald S. Demcko , Cory Nelson , Marianne Berolini , Jeff Borgman
IPC: H01L29/94
CPC classification number: H01L29/94
Abstract: A metal-oxide-semiconductor (MOS) capacitor can include a substrate comprising a semiconductor material, an oxide layer formed over a first surface of the substrate, a resistive layer formed over at least a portion of the oxide layer, and a conductive layer formed over at least a portion of the resistive layer. As such, the MOS capacitor can include a resistor and a capacitor formed in series with one another.
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