Invention Application
- Patent Title: SURFACE SHAPE MEASURING DEVICE AND SURFACE SHAPE MEASUREMENT METHOD
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Application No.: US18795866Application Date: 2024-08-06
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Publication No.: US20240393104A1Publication Date: 2024-11-28
- Inventor: Yoshiyuki KAWATA , Katsufumi MORIYAMA , Hideki MORII
- Applicant: Tokyo Seimitsu Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Tokyo Seimitsu Co., Ltd.
- Current Assignee: Tokyo Seimitsu Co., Ltd.
- Current Assignee Address: JP Tokyo
- Priority: JP2022-017254 20220207,JP2022-017255 20220207
- Main IPC: G01B11/24
- IPC: G01B11/24 ; G01D5/347 ; H04N23/695

Abstract:
A surface shape measuring device includes a camera that captures the observation image acquired by the optical head, a drive unit that causes the optical head to scan relatively in a scanning direction perpendicular to the measurement target, an encoder for detecting a position of the optical head in the scanning direction with respect to the measurement target, an imaging instructing unit that instructs the camera to capture the observation image based on a position signal output from the encoder for each predetermined interval, a frame dropping occurrence rate calculating unit that calculates a frame dropping occurrence rate indicating an occurrence rate of frame dropping of the camera, and a measurement condition setting unit that sets a measurement condition for measuring a surface shape of the measurement target based on the frame dropping occurrence rate.
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