公开(公告)号：US20240393104A1

公开(公告)日：2024-11-28

申请号：US18795866

申请日：2024-08-06

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yoshiyuki KAWATA ,  Katsufumi MORIYAMA ,  Hideki MORII

IPC: G01B11/24 ,  G01D5/347 ,  H04N23/695

Abstract: A surface shape measuring device includes a camera that captures the observation image acquired by the optical head, a drive unit that causes the optical head to scan relatively in a scanning direction perpendicular to the measurement target, an encoder for detecting a position of the optical head in the scanning direction with respect to the measurement target, an imaging instructing unit that instructs the camera to capture the observation image based on a position signal output from the encoder for each predetermined interval, a frame dropping occurrence rate calculating unit that calculates a frame dropping occurrence rate indicating an occurrence rate of frame dropping of the camera, and a measurement condition setting unit that sets a measurement condition for measuring a surface shape of the measurement target based on the frame dropping occurrence rate.

公开(公告)号：US20240393097A1

公开(公告)日：2024-11-28

申请号：US18795599

申请日：2024-08-06

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yoshiyuki KAWATA ,  Katsufumi MORIYAMA ,  Hideki MORII

IPC: G01B9/02055 ,  G01B11/24

Abstract: A three-dimensional shape measuring device includes a holder that changes the reference light path length in response to temperature change, and a temperature adjusting unit that adjusts a temperature of the holder to a target temperature, so as to make a measurement light path length equal to a reference light path length with high accuracy at low cost regardless of a temperature of an installation environment. A three-dimensional shape measuring device includes a temperature adjusting unit that adjusts the temperature of the holder and a temperature control unit that controls the temperature adjusting unit so as to selectively switch a measurement mode between a first measurement mode in which the reference light path length is made equal to a measurement light path length and a second measurement mode in which the reference light path length is made different from the measurement light path length.

公开(公告)号：US20240393098A1

公开(公告)日：2024-11-28

申请号：US18795910

申请日：2024-08-06

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yoshiyuki KAWATA ,  Katsufumi MORIYAMA ,  Hideki MORII

IPC: G01B9/02055 ,  G01B11/24

Abstract: An adjustment method for a shape measuring device that radiates light from a light source to a master for adjustment and a reference surface respectively as measurement light and reference light and measures a shape of a surface to be measured of a measurement target using multiplexed light of the measurement light and the reference light respectively reflected by the master for adjustment and the reference surface, the adjustment method including; measuring the master for adjustment in an adjusted state in which a focus position matches an interference position and calculating and storing a matching degree parameter indicating a matching degree between the focus position and the interference position as an adjustment matching degree parameter; when the measurement target is measured, measuring the master for adjustment, calculating the matching degree parameter and comparing the matching degree parameter with the adjustment matching degree parameter, to confirm the matching degree.

公开(公告)号：US20240011767A1

公开(公告)日：2024-01-11

申请号：US18472361

申请日：2023-09-22

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Yoshiyuki KAWATA

IPC: G01B11/24

CPC classification number: G01B11/24

Abstract: The calibration method includes changing the emission direction of the measurement light to be emitted from the optical rotation probe by a minute angle from a reference direction set in advance, acquiring a shape error for a reference object after changing the emission direction by emitting the measurement light from the optical rotation probe toward the reference object while rotating the emission direction of the measurement light around an S axis and varying a relative position between the optical rotation probe and the reference object, and calculating an adjustment error of the emission direction of the measurement light with respect to the reference direction based on a theoretical value of the shape error for the reference object to be obtained in a case where the emission direction of the measurement light matches the reference direction and a measurement value of the acquired shape error for the reference object.