Invention Application
- Patent Title: BACKSIDE CONTACT
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Application No.: US18787223Application Date: 2024-07-29
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Publication No.: US20240395938A1Publication Date: 2024-11-28
- Inventor: Li-Zhen Yu , Huan-Chieh Su , Lin-Yu Huang , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L29/08 ; H01L29/66

Abstract:
A semiconductor structure and a method of forming the same are provided. In an embodiment, a semiconductor structure includes an epitaxial source feature and an epitaxial drain feature, a vertical stack of channel members disposed over a backside dielectric layer, the vertical stack of channel members extending between the epitaxial source feature and the epitaxial drain feature along a direction, a gate structure wrapping around each of the vertical stack of channel members, and a backside source contact disposed in the backside dielectric layer. The backside source contact includes a top portion adjacent the epitaxial source feature and a bottom portion away from the epitaxial source feature. The top portion and the bottom portion includes a step width change along the direction.
Information query
IPC分类: