Invention Application
- Patent Title: PLASMA PROCESSING APPARATUS, CONTROL METHOD, AND STORING MEDIUM
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Application No.: US18690810Application Date: 2022-09-05
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Publication No.: US20240404805A1Publication Date: 2024-12-05
- Inventor: Mikio SATO , Eiki KAMATA , Taro IKEDA , Nobuhiko YAMAMOTO
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-ku, Tokyo
- Priority: JP2021-152599 20210917
- International Application: PCT/JP2022/033247 WO 20220905
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A plasma processing apparatus includes a control device and configured to plasmarize a gas supplied to an interior of a processing container to perform a plasma processing on an object to be processed, wherein the control device includes: a measurer configured to measure an electron energy distribution function of plasma in the interior of the processing container, and a parameter changer configured to change parameters relating to the plasma processing so that the electron energy distribution function measured by the measurer during the plasma processing approaches a target electron energy distribution function.
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