Invention Application
- Patent Title: EPOXY RESIN COMPOSITION, CURED PRODUCT, ENCAPSULANT AND ADHESIVE
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Application No.: US18713564Application Date: 2022-12-26
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Publication No.: US20250034319A1Publication Date: 2025-01-30
- Inventor: Ryosuke OKAMOTO , Naoya KAMIMURA , Kenzo ONIZUKA
- Applicant: ASAHI KASEI KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Priority: JP2021-213746 20211228
- International Application: PCT/JP2022/047933 WO 20221226
- Main IPC: C08G59/40
- IPC: C08G59/40 ; C08K3/013 ; C08K5/00 ; C09J163/00 ; H01L23/29
Abstract:
Provided is an epoxy resin composition containing (A) epoxy resin, and (B) a heteroatom-containing curing agent, wherein molecular weight α of the heteroatom-containing curing agent (B) is 200≤α≤1200, and ratio α/β of the molecular weight α to number β of heteroatoms in a structure of the heteroatom-containing curing agent (B) is 30≤α/β≤95.
Information query
