公开(公告)号：US20240301176A1

公开(公告)日：2024-09-12

申请号：US18268741

申请日：2021-12-14

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Kenzo ONIZUKA ,  Naoya KAMIMURA ,  Masanori YOSHIDA

IPC: C08K9/10 ,  C08K3/013 ,  C08K5/05 ,  C09J163/00 ,  H01L23/498 ,  H05K3/46

CPC classification number: C08K9/10 ,  C08K3/013 ,  C08K5/05 ,  C09J163/00 ,  C08K2201/003 ,  C08K2201/006 ,  H01L23/49894 ,  H05K3/4661 ,  H05K2203/068 ,  H05K2203/107 ,  H05K2203/1461

Abstract: An epoxy resin composition comprising an epoxy resin (A) and a latent curing agent (B), wherein the latent curing agent (B) is solid at 25° C.

公开(公告)号：US20240376291A1

公开(公告)日：2024-11-14

申请号：US18578389

申请日：2022-06-08

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Naohiro KOBAYASHI ,  Masanori YOSHIDA ,  Kenzo ONIZUKA

IPC: C08K5/13 ,  C08G59/22 ,  C08G59/24 ,  C08G59/50 ,  C08J5/18

Abstract: The present invention provides an epoxy resin composition containing: a component (A): epoxy resin; a component (B): microcapsular curing agent; a component (C): reactive diluent; and a component (D): compound represented by formula (1) below: wherein X1 has 2 or more and 5 or less consecutive carbon-carbon bonds, and a substituent of carbon contained in X1 and R1 to R5 are each one selected from the group consisting of hydrogen, an alkyl group, an unsaturated aliphatic group, an aromatic group, a heteroatom-containing substituent, a halogen atom-containing substituent, and a halogen atom; the substituent of carbon contained in X1 and R1 to R5 are the same as or different from each other; and the compound is optionally a fused ring compound in which any of R1 to R5 are present in the same ring.

公开(公告)号：US20250034319A1

公开(公告)日：2025-01-30

申请号：US18713564

申请日：2022-12-26

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Ryosuke OKAMOTO ,  Naoya KAMIMURA ,  Kenzo ONIZUKA

IPC: C08G59/40 ,  C08K3/013 ,  C08K5/00 ,  C09J163/00 ,  H01L23/29

Abstract: Provided is an epoxy resin composition containing (A) epoxy resin, and (B) a heteroatom-containing curing agent, wherein molecular weight α of the heteroatom-containing curing agent (B) is 200≤α≤1200, and ratio α/β of the molecular weight α to number β of heteroatoms in a structure of the heteroatom-containing curing agent (B) is 30≤α/β≤95.

公开(公告)号：US20200087445A1

公开(公告)日：2020-03-19

申请号：US16494404

申请日：2018-03-16

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Kenzo ONIZUKA ,  Yoshinori OZUMI ,  Takanori MAEDA

IPC: C08G59/56 ,  C08L63/00 ,  C08G59/40

Abstract: A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130° C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85° C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.