Invention Application
- Patent Title: THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY
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Application No.: US18953248Application Date: 2024-11-20
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Publication No.: US20250087270A1Publication Date: 2025-03-13
- Inventor: Hiroshi MAEJIMA
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2008-112659 20080423
- Main IPC: G11C16/10
- IPC: G11C16/10 ; G11C5/02 ; G11C5/06 ; G11C16/04 ; G11C16/08 ; G11C16/34

Abstract:
A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block.
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