Invention Grant
- Patent Title: Etching of semiconductor coatings of sio2
- Patent Title (中): SIO2半导体涂层的蚀刻
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Application No.: US3497407DApplication Date: 1966-12-28
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Publication No.: US3497407APublication Date: 1970-02-24
- Inventor: ESCH RONALD P , PLISKIN WILLIAM A
- Applicant: IBM
- Assignee: Ibm
- Current Assignee: Ibm
- Priority: US60539066 1966-12-28
- Main IPC: C23F1/10
- IPC: C23F1/10 ; C23F1/14 ; H01L21/308 ; H01L21/311 ; H01L23/29 ; H01L23/485 ; H01L7/00
Information query
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