Patent search ap:("IBM") AND inv:"ESCH RONALD P" Page 1

1.

发明授权
Photosensitive glass technique for forming contact holes in protective glass layers 失效
Title translation: 用于在保护玻璃层中形成接触孔的感光玻璃技术

公开(公告)号：US3542550A

公开(公告)日：1970-11-24

申请号：US3542550D

申请日：1966-09-30

Applicant: IBM

Inventor： CONRAD ERNEST E , ESCH RONALD P , HALLEN ROBERT L , LEONARD RICHARD A , PLISKIN WILLIAM A

IPC: H01L21/00 , H01L23/29 , H01L23/31 , H01L23/485 , G03C5/00 , H05K3/28

CPC classification number: H01L23/3157 , H01L21/00 , H01L23/291 , H01L23/485 , H01L2924/0002 , Y10S438/95 , H01L2924/00

2.

发明授权
Etching of semiconductor coatings of sio2 失效
Title translation: SIO2半导体涂层的蚀刻

公开(公告)号：US3497407A

公开(公告)日：1970-02-24

申请号：US3497407D

申请日：1966-12-28

Applicant: IBM

Inventor： ESCH RONALD P , PLISKIN WILLIAM A

IPC: C23F1/10 , C23F1/14 , H01L21/308 , H01L21/311 , H01L23/29 , H01L23/485 , H01L7/00

CPC classification number: H01L23/291 , H01L21/31111 , H01L23/485 , H01L2924/0002 , Y10S148/043 , Y10S148/051 , Y10S148/173 , H01L2924/00

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