公开(公告)号：US3212929A

公开(公告)日：1965-10-19

申请号：US18174362

申请日：1962-03-22

Applicant: IBM

Inventor： PLISKIN WILLIAM A ,  CONRAD ERNEST E

IPC: C03C17/02 ,  C23D5/02

CPC classification number: C23D5/02 ,  C03C17/02

公开(公告)号：US3580066A

公开(公告)日：1971-05-25

申请号：US3580066D

申请日：1969-06-19

Applicant: IBM

Inventor： PLISKIN WILLIAM A ,  TAYLOR JAMES E

IPC: H01L21/66 ,  C23F1/00 ,  H01L21/306 ,  H01L23/29 ,  G01N13/00

CPC classification number: H01L23/291 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The method for determining the completeness of etching of an oxide from a silicon semiconductor device discloses that bare silicon surfaces are hydrophobic while clean freshly etched oxide surfaces are hydrophilic. To determine whether the silicon is exposed, and therefore free of any oxide film subsequent to etching, the device is cooled and subjected to a stream of moist gas and observed under a microscope. If the etching process by which small holes are formed is incomplete, oxide will remain in the hole and therefore a film of condensed water will form in the holes indicating incomplete etching. If the etching process has been properly completed in the holes, bare silicon will remain causing the moisture to form in small droplets. The form of the moisture can be observed through the microscope.

公开(公告)号：US3212921A

公开(公告)日：1965-10-19

申请号：US14166861

申请日：1961-09-29

Applicant: IBM

Inventor： PLISKIN WILLIAM A ,  CONRAD ERNEST E

IPC: C23C16/40 ,  C23D5/02 ,  C23D11/00 ,  H01B3/08 ,  H01C17/02 ,  H01G13/00 ,  H01L21/316 ,  H01L23/29

CPC classification number: H01L21/316 ,  C23C16/401 ,  C23D5/02 ,  C23D11/00 ,  H01B3/088 ,  H01C17/02 ,  H01G13/003 ,  H01L23/29 ,  H01L2924/0002 ,  Y10S148/043 ,  Y10S148/118 ,  Y10T428/23 ,  Y10T428/265 ,  H01L2924/00

公开(公告)号：US3505106A

公开(公告)日：1970-04-07

申请号：US3505106D

申请日：1965-09-22

Applicant: IBM

Inventor： PLISKIN WILLIAM A ,  CONRAD ERNEST E

IPC: C23C16/40 ,  C23D5/02 ,  C23D11/00 ,  H01B3/08 ,  H01C17/02 ,  H01G13/00 ,  H01L21/316 ,  H01L23/29

CPC classification number: H01L21/316 ,  C23C16/401 ,  C23D5/02 ,  C23D11/00 ,  H01B3/088 ,  H01C17/02 ,  H01G13/003 ,  H01L23/29 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：US3317332A

公开(公告)日：1967-05-02

申请号：US37382864

申请日：1964-06-09

Applicant: IBM

Inventor： PLISKIN WILLIAM A

IPC: C03C17/28 ,  H01L23/31

CPC classification number: C03C17/28 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：US3542550A

公开(公告)日：1970-11-24

申请号：US3542550D

申请日：1966-09-30

Applicant: IBM

Inventor： CONRAD ERNEST E ,  ESCH RONALD P ,  HALLEN ROBERT L ,  LEONARD RICHARD A ,  PLISKIN WILLIAM A

IPC: H01L21/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/485 ,  G03C5/00 ,  H05K3/28

CPC classification number: H01L23/3157 ,  H01L21/00 ,  H01L23/291 ,  H01L23/485 ,  H01L2924/0002 ,  Y10S438/95 ,  H01L2924/00

公开(公告)号：US3497407A

公开(公告)日：1970-02-24

申请号：US3497407D

申请日：1966-12-28

Applicant: IBM

Inventor： ESCH RONALD P ,  PLISKIN WILLIAM A

IPC: C23F1/10 ,  C23F1/14 ,  H01L21/308 ,  H01L21/311 ,  H01L23/29 ,  H01L23/485 ,  H01L7/00

CPC classification number: H01L23/291 ,  H01L21/31111 ,  H01L23/485 ,  H01L2924/0002 ,  Y10S148/043 ,  Y10S148/051 ,  Y10S148/173 ,  H01L2924/00

公开(公告)号：US3243314A

公开(公告)日：1966-03-29

申请号：US22380462

申请日：1962-09-14

Applicant: IBM

Inventor： LEHMAN HERBERT S ,  PLISKIN WILLIAM A ,  RUGGLES JR RUDY L

IPC: C23C8/16 ,  C23C16/40 ,  H01B1/08 ,  H01B3/02 ,  H01B3/10 ,  H01L21/316

CPC classification number: H01L21/02164 ,  C23C8/16 ,  C23C16/402 ,  H01B1/08 ,  H01B3/02 ,  H01B3/10 ,  H01L21/02216 ,  H01L21/02271 ,  H01L21/02337 ,  H01L21/31612 ,  Y10S148/003 ,  Y10S148/043 ,  Y10S148/117 ,  Y10S148/118 ,  Y10S438/958