Invention Grant
- Patent Title: Electroless nickel plating on nonconductive substrates
- Patent Title (中): 非电极基体上的电镀镍镀层
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Application No.: US3639143DApplication Date: 1969-02-19
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Publication No.: US3639143APublication Date: 1972-02-01
- Inventor: LUSSOW ROBERT O , WIRTZ LOUIS H
- Applicant: IBM
- Assignee: Ibm
- Current Assignee: Ibm
- Priority: US80059769 1969-02-19
- Main IPC: H05K3/18
- IPC: H05K3/18 ; C03C17/10 ; C23C18/18 ; C23C18/32 ; C23C18/36 ; G03F1/54 ; B44D1/092 ; C23C3/02
Abstract:
A process for electroless deposition of uniform and consistent dense nickel films on nonconductive substrates utilizing conventional techniques. The process requires at least two repetitive cycles of activation, electroless plating of nickel and heating.
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