A printed circuit board for mounting integrated circuit and resistor network packages commonly referred to as flatpack components and a process for fabricating the circuit board. The printed circuit board has a conductive pattern of electrical connection pads for connecting to electrical leads from flatpack components and electrical conductors for connecting the pads to circuitry external to the board. A channel for receiving and aligning each electrical lead from a flatpack component is formed by printed circuit techniques. The surface layer of each channel is formed of solder which simplifies the process of electrically connecting flatpack leads and reduces errors occuring in the soldering process.