公开(公告)号：US1401731A

公开(公告)日：1921-12-27

申请号：US31961319

申请日：1919-08-25

申请人： REIMANN FRED W

发明人： REIMANN FRED W

IPC分类号： G09F13/14

CPC分类号： G09F13/14

公开(公告)号：US3778530A

公开(公告)日：1973-12-11

申请号：US3778530D

申请日：1972-07-05

申请人： REIMANN W

发明人： REIMANN W

IPC分类号： H05K1/11 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34 ,  H05K7/10

CPC分类号： H05K3/3421 ,  H05K1/111 ,  H05K3/062 ,  H05K3/064 ,  H05K3/108 ,  H05K3/243 ,  H05K7/1023 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/09745 ,  H05K2201/10689 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/048 ,  H05K2203/058 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

摘要： A printed circuit board for mounting integrated circuit and resistor network packages commonly referred to as flatpack components and a process for fabricating the circuit board. The printed circuit board has a conductive pattern of electrical connection pads for connecting to electrical leads from flatpack components and electrical conductors for connecting the pads to circuitry external to the board. A channel for receiving and aligning each electrical lead from a flatpack component is formed by printed circuit techniques. The surface layer of each channel is formed of solder which simplifies the process of electrically connecting flatpack leads and reduces errors occuring in the soldering process.

摘要翻译： 用于安装通常称为扁平封装部件的集成电路和电阻器网络封装的印刷电路板以及用于制造电路板的工艺。 印刷电路板具有电连接焊盘的导电图案，用于连接到来自扁平封装部件和电导体的电引线，用于将焊盘连接到板外部的电路。 用于通过印刷电路技术形成用于从扁平封装部件接收和对准每个电引线的通道。 每个通道的表面层由焊料形成，这简化了电连接扁平封装引线的过程，并减少了焊接过程中发生的错误。