An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a soldernonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shapes of the solder bands and by reducing their structural integrity though the creation of numerous hairline fractures.