公开(公告)号：US3905665A

公开(公告)日：1975-09-16

申请号：US34079773

申请日：1973-03-13

申请人： AMP INC

发明人： LYNCH JAMES EDWARD ,  PARMER KENNETH RONALD ,  COBAUGH ROBERT FRANKLIN

IPC分类号： H01R4/02 ,  H01R12/58 ,  H05K3/40 ,  H05K1/07

CPC分类号： H01R12/585 ,  H01R4/028 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09118

摘要： According to one aspect of the disclosure, a planar substrate receives a plurality of conductive posts therein, which posts include an offset medial portion having a laterally projecting notch portion. Certain posts are arranged with their notch portions in coplanar relationship and in latching registration with an interior sidewall portion of a housing received over the posts. Accordingly, the housing provides an insulating receptacle shroud for the posts and is latchingly retained in place without a need for attachment to the substrate. The shroud is also provided with card guides connected thereto by integral hinge portions enabling alignment of, and reducing twisting and warping of, the card guides. The card guides are additionally coupled together with rails further reducing twisting and warping of the guides. The terminals are advantageously mounted in strip form for ease in manufacture and assembly to the substrate.

摘要翻译： 根据本公开的一个方面，平面基板在其中容纳多个导电柱，所述支柱包括具有横向突出的切口部分的偏移中间部分。 一些柱被布置成具有共同关系的切口部分并且与容纳在柱上的壳体的内侧壁部分锁定配准。 因此，壳体为柱提供绝缘的容器护罩，并且闩锁地保持在适当的位置，而不需要附接到衬底。 护罩还设置有通过整体铰链部分连接到其上的卡导向件，从而能够对准卡导向件的扭转和翘曲。 卡引导件另外用轨道连接在一起，进一步减少了引导件的扭曲和翘曲。 端子有利地以条形形式安装，以便于制造和组装到基板。

公开(公告)号：US3915546A

公开(公告)日：1975-10-28

申请号：US48750574

申请日：1974-07-11

申请人： AMP INC

发明人： COBAUGH ROBERT FRANKLIN ,  PARMER KENNETH RONALD

IPC分类号： B23K3/06 ,  H01R4/02 ,  H01R43/02 ,  H05K3/34 ,  H01R9/06

CPC分类号： H01R4/028 ,  B23K3/0676 ,  B23K2201/36 ,  H01R43/0235 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10984 ,  H05K2201/2081

摘要： An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a soldernonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shapes of the solder bands and by reducing their structural integrity though the creation of numerous hairline fractures.

摘要翻译： 公开了一种电气端子结构，其具有粘附到端子的选定部分上的流动沉积量或焊料带，并且被限制在端子的表面上通过存在不可焊接材料而不是必须 触摸终端 还公开了将带状电端子安装在设置在基板中的电镀孔中的方法，其中根据上述应用技术将焊带施加到端子。 还公开了使焊接条平坦化的技术，并且所得到的端接结构具有粘附在其上的扁平焊接带。 焊接带的扁平化有助于通过改变焊接带的形状并且通过减少它们的结构完整性来将带状端子插入电镀孔中，同时产生许多发条断裂。