发明授权
- 专利标题: High power semiconductor diode
- 专利标题(中): 大功率半导体二极管
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申请号: US677807申请日: 1976-04-16
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公开(公告)号: US4089020A公开(公告)日: 1978-05-09
- 发明人: Takahide Ikeda , Michio Ishikawa
- 申请人: Takahide Ikeda , Michio Ishikawa
- 申请人地址: JA
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JA
- 优先权: JA50-45282 19750416
- 主分类号: H01L21/265
- IPC分类号: H01L21/265 ; H01L29/47 ; H01L29/861 ; H01L29/872 ; H01L29/48 ; H01L29/56 ; H01L29/64
摘要:
A semiconductor diode consists of a low resistivity n conductivity type semiconductor substrate, a high resistivity n conductivity type semiconductor layer, formed on the surface of the substrate, a high resistivity p conductivity type semiconductor layer, whose thickness is smaller than the diffusion length of electrons, formed on the n conductivity type layer, a metal electrode forming a Schottky barrier contact with the p conductivity type layer, and an electrode forming an ohmic contact with the substrate.
公开/授权文献
- US5977260A Adhesive thermoplastic composition 公开/授权日:1999-11-02
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