Thermoplastic molding compositions are provided comprising from about 80 to 98% by weight of a polycarbonate obtained from diphenols, having a mean weight-average molecular weight M.sub.w from about 10,000 to 200,000 and from about 20 to 2% by weight of a polyester-carbonate and/or polyether-carbonate with mean weight-average molecular weights M.sub.w of from about 50,000 to 300,000, which contain between about 50 and 70% by weight of soft polyester segments or soft polyether segments with mean number-average molecular weights M.sub.n of from about 10,000 to 20,000. The instant invention also relates to a process for the production of said thermoplastic molding compositions. These thermoplastic molding compositions show markedly improved resilience properties compared with known polycarbonates and can be employed as films and shaped articles in all cases where, on the one hand, high notched impact strength at low temperatures, high toughness properties at relatively high wall thicknesses, and transparency are required.