发明授权
- 专利标题： Flat shaped semiconductor encapsulation
- 专利标题（中）： 平面半导体封装
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申请号： US190744申请日： 1980-09-25
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公开(公告)号： US4300153A公开(公告)日： 1981-11-10
- 发明人: Masao Hayakawa , Takamichi Maeda , Masao Kumura
- 申请人： Masao Hayakawa , Takamichi Maeda , Masao Kumura
- 申请人地址： JPX Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JPX Osaka
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/31 ; H01L23/28 ; H01L23/02 ; H01L39/02
摘要：
Electrodes are formed on one major surface of a semiconductor chip and electrically connected to lead electrodes carried by a support substrate. A cover plate is fixed to the opposing major surface of the semiconductor chip to determine one major surface of semiconductor device. Remaining surfaces of the semiconductor chip are encapsulated by a resin mold. The cover plate comprises a flexible glass cloth impregnated with half cured epoxy resin.
公开/授权文献
- US5387241A Ribbed augment for a prosthetic implant 公开/授权日：1995-02-07
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