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8 条记录 (耗时 0.011 秒)

    CHIP LED
    1.
    发明申请
    CHIP LED 审中-公开
    芯片LED

    公开(公告)号：US20120217526A1

    公开(公告)日：2012-08-30

    申请号：US13396194

    申请日：2012-02-14

    申请人： Masao KUMURA

    发明人： Masao KUMURA

    IPC分类号： H01L33/40

    CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The chip LED includes a plurality of semiconductor chips at least one of which is a light-emitting element; a recess formed on the packaging substrate having a rear-side metallic layer on the rear-side thereof, and a metallic layer formed on the bottom surface and inner wall surface of the recess; the light-emitting element being die-bonded to the metallic layer formed on the bottom surface of the recess and being wire-bonded to a wiring pattern deposited on the surface of the packaging substrate; and the metallic layer formed on the bottom surface of the recess being electrically conducted to the rear-side metallic layer formed on the rear side of the packaging substrate.

    摘要翻译： 芯片LED包括多个半导体芯片，其中至少一个是发光元件; 形成在其背面具有后侧金属层的包装衬底上的凹部和形成在凹部的底表面和内壁表面上的金属层; 所述发光元件与形成在所述凹部的底面上的所述金属层被芯片接合，并且被引线接合到沉积在所述封装基板的表面上的布线图案; 并且形成在凹部的底表面上的金属层被导电到形成在包装基板的后侧上的后侧金属层。

    Flat shaped semiconductor encapsulation
    3.
    发明授权
    Flat shaped semiconductor encapsulation 失效
    平面半导体封装

    公开(公告)号：US4300153A

    公开(公告)日：1981-11-10

    申请号：US190744

    申请日：1980-09-25

    申请人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

    发明人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

    IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/28 ,  H01L23/02 ,  H01L39/02

    CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L2224/16

    摘要： Electrodes are formed on one major surface of a semiconductor chip and electrically connected to lead electrodes carried by a support substrate. A cover plate is fixed to the opposing major surface of the semiconductor chip to determine one major surface of semiconductor device. Remaining surfaces of the semiconductor chip are encapsulated by a resin mold. The cover plate comprises a flexible glass cloth impregnated with half cured epoxy resin.

    摘要翻译： 电极形成在半导体芯片的一个主表面上并电连接到由支撑衬底承载的引线电极。 盖板固定到半导体芯片的相对主表面以确定半导体器件的一个主表面。 半导体芯片的剩余表面被树脂模具封装。 盖板包括浸渍有半固化环氧树脂的柔性玻璃布。

    Multi-lead frame member with means for limiting mold spread
    4.
    发明授权
    Multi-lead frame member with means for limiting mold spread 失效
    多引线框架构件，用于限制模具扩展

    公开(公告)号：US4280132A

    公开(公告)日：1981-07-21

    申请号：US84542

    申请日：1979-10-15

    申请人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

    发明人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

    IPC分类号： H01L23/28 ,  H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48 ,  H01L29/44 ,  H01L29/60

    CPC分类号： H01L23/3157 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49838 ,  H01L2224/16 ,  Y10T29/49121

    摘要： Blocking members are provided for limiting mold spread over a desirable area while a semiconductor is molded. The blocking members are composed within a metallic layer together with metallic leads by photoetching techniques. The blocking members are positioned at four corners of an aperture in a predetermined pattern of generally radial fingers extending cantilever-wise inwardly beyond the periphery of the aperture. The semiconductor is adapted to engage bumps on the semiconductor to the metallic leads by wire bonding methods. Extended portions of the metallic leads may also function as the blocking members, with the metallic leads being positioned at the four corners of the aperture.

    摘要翻译： 提供了阻挡构件，用于在模制半导体时限制模具在所需区域上的扩展。 阻挡构件通过光刻技术与金属引线一起组成金属层。 阻挡构件定位在孔径的四个角部处，其以大致径向指状物的预定图案延伸，向内延伸超过孔的周边。 半导体适于通过引线接合方法将半导体上的凸块接合到金属引线。 金属引线的延伸部分也可以用作阻挡构件，金属引线位于孔的四个角处。

    Light emitter
    5.
    发明授权
    Light emitter 有权
    光发射器

    公开(公告)号：US07897989B2

    公开(公告)日：2011-03-01

    申请号：US12744234

    申请日：2007-11-21

    申请人： Masao Kumura

    发明人： Masao Kumura

    IPC分类号： H01L33/48 ,  H01L21/56

    CPC分类号： H01L33/56 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The invention relates to a light emitter, such as an LED sealed with a resin, in particular, an LED wherein irregularities in a surface of a sealing resin can be formed through a simpler process in order to improve the light output efficiency of the LED. The LED is an LED wherein a liquid sealing resin is mixed with a solid transparent resin different from the sealing resin in specific gravity and subsequently the mixture is injected into a package into which an LED chip is integrated and then cured, thereby sealing the chip, characterized in that the solid transparent resin is fixed to the sealing resin to be partially naked to the sealing-resin-side surface of the LED through which light from the LED chip is emitted to the outside, and be partially embedded in the sealing resin, thereby being projected into the form of convexes. This LED is used for an LED displayer, an LCD backlight source, a lighting device or the like.

    摘要翻译： 本发明涉及一种光发射器，例如用树脂密封的LED，特别是LED，其中可以通过更简单的工艺形成密封树脂的表面中的凹凸，以便提高LED的光输出效率。 LED是其中将液体密封树脂与密封树脂不同的固体透明树脂按比重混合并随后将混合物注入到其中整合LED芯片然后固化的封装中，从而密封芯片， 其特征在于，所述固体透明树脂固定在所述密封树脂上，以部分地裸露在所述LED的密封树脂侧表面上，所述密封树脂侧表面通过所述密封树脂侧表面从所述LED芯片发射到外部，并且部分地嵌入所述密封树脂中， 从而投影成凸起的形式。 该LED用于LED显示器，LCD背光源，照明装置等。

    LIGHT EMITTER
    7.
    发明申请
    LIGHT EMITTER 有权
    发光二极管

    公开(公告)号：US20100289048A1

    公开(公告)日：2010-11-18

    申请号：US12744234

    申请日：2007-11-21

    申请人： Masao Kumura

    发明人： Masao Kumura

    IPC分类号： H01L33/56 ,  H01L33/58

    CPC分类号： H01L33/56 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The invention relates to a light emitter, such as an LED sealed with a resin, in particular, an LED wherein irregularities in a surface of a sealing resin can be formed through a simpler process in order to improve the light output efficiency of the LED. The LED is an LED wherein a liquid sealing resin is mixed with a solid transparent resin different from the sealing resin in specific gravity and subsequently the mixture is injected into a package into which an LED chip is integrated and then cured, thereby sealing the chip, characterized in that the solid transparent resin is fixed to the sealing resin to be partially naked to the sealing-resin-side surface of the LED through which light from the LED chip is emitted to the outside, and be partially embedded in the sealing resin, thereby being projected into the form of convexes. This LED is used for an LED displayer, an LCD backlight source, a lighting device or the like.

    摘要翻译： 本发明涉及一种光发射器，例如用树脂密封的LED，特别是LED，其中可以通过更简单的工艺形成密封树脂的表面中的凹凸，以便提高LED的光输出效率。 LED是其中将液体密封树脂与密封树脂不同的固体透明树脂按比重混合并随后将混合物注入到其中整合LED芯片然后固化的封装中，从而密封芯片， 其特征在于，所述固体透明树脂固定在所述密封树脂上，以部分地裸露在所述LED的密封树脂侧表面上，所述密封树脂侧表面通过所述密封树脂侧表面从所述LED芯片发射到外部，并且部分地嵌入所述密封树脂中， 从而投影成凸起的形式。 该LED用于LED显示器，LCD背光源，照明装置等。