发明授权
- 专利标题: Structure for and method of manufacturing a semiconductor device by the master slice method
- 专利标题(中): 通过主切片方法制造半导体器件的结构和方法
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申请号: US207737申请日: 1980-11-17
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公开(公告)号: US4388755A公开(公告)日: 1983-06-21
- 发明人: Hiromu Enomoto , Yasushi Yasuda , Yoshiharu Mitono , Taketo Imaizumi , Hitoshi Ohmichi
- 申请人: Hiromu Enomoto , Yasushi Yasuda , Yoshiharu Mitono , Taketo Imaizumi , Hitoshi Ohmichi
- 申请人地址: JPX Kawasaki
- 专利权人: Fujitsu Limited
- 当前专利权人: Fujitsu Limited
- 当前专利权人地址: JPX Kawasaki
- 优先权: JPX54-150307 19791120
- 主分类号: H01L29/73
- IPC分类号: H01L29/73 ; H01L21/331 ; H01L21/82 ; H01L21/822 ; H01L21/8222 ; H01L23/52 ; H01L27/04 ; H01L27/082 ; H01L27/118 ; H01L29/08
摘要:
A structure and method for manufacturing semiconductor devices by the master slice method, in which various kinds of semiconductor devices are manufactured through utilization of a common master pattern and a plurality of different kinds of selective wiring patterns. A number of bipolar transistors each having plural emitter regions, is formed in a predetermined region, or portion, of a semiconductor substrate by employing a common master pattern, and the plural emitter regions of the respective bipolar transistors are selectively connected by the associated wiring patterns of each thereof to form corresponding bipolar transistors of different, predetermined D.C. characteristics. When manufacturing many different kinds of semiconductor devices by the master slice method, the area which would be wasted on the semiconductor substrate by prior art techniques is greatly reduced, thus providing for enhanced area efficiency.
公开/授权文献
- US6017156A Aperture/shutter system and a stepper motor for use therein 公开/授权日:2000-01-25