发明授权
- 专利标题： Process for producing printed circuit boards
- 专利标题（中）： 印刷电路板生产工艺
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申请号： US485399申请日： 1983-04-15
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公开(公告)号： US4457952A公开(公告)日： 1984-07-03
- 发明人: Mineo Kawamoto , Kanji Murakami , Yutaka Itoh , Youichi Matsuda , Motoyo Wajima , Hirosada Morishita , Shoji Kawakubo , Toyofusa Yoshimura
- 申请人： Mineo Kawamoto , Kanji Murakami , Yutaka Itoh , Youichi Matsuda , Motoyo Wajima , Hirosada Morishita , Shoji Kawakubo , Toyofusa Yoshimura
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX55-140445 19801009
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K3/18 ; H05K3/38 ; C23C3/02
摘要：
When an alkaline earth metal carbonate powder is mixed with an adhesive and is formed into an adhesive layer in a conventional covering method, a problem of the transfer of catalyst for electroless plating during a masking step or later electroless plating step is solved. Further, blisters under plated film caused by a fire retardant contained in an insulating substrate is also overcome by the use of alkaline earth metal powder.
公开/授权文献
- US5099016A Substituted 7-oxomitosanes 公开/授权日：1992-03-24
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