公开(公告)号：US4457952A

公开(公告)日：1984-07-03

申请号：US485399

申请日：1983-04-15

申请人： Mineo Kawamoto ,  Kanji Murakami ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita ,  Shoji Kawakubo ,  Toyofusa Yoshimura

发明人： Mineo Kawamoto ,  Kanji Murakami ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita ,  Shoji Kawakubo ,  Toyofusa Yoshimura

IPC分类号： H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02

CPC分类号： H05K3/181 ,  H05K3/184 ,  H05K3/387 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2203/0773 ,  H05K2203/1407

摘要： When an alkaline earth metal carbonate powder is mixed with an adhesive and is formed into an adhesive layer in a conventional covering method, a problem of the transfer of catalyst for electroless plating during a masking step or later electroless plating step is solved. Further, blisters under plated film caused by a fire retardant contained in an insulating substrate is also overcome by the use of alkaline earth metal powder.

摘要翻译： 当将碱土金属碳酸盐粉末与粘合剂混合并且以常规的覆盖方法形成粘合剂层时，解决了在掩蔽步骤或稍后的无电解电镀步骤期间用于化学镀的催化剂的转移的问题。 此外，通过使用碱土金属粉末也克服了由绝缘基板中包含的阻燃剂引起的电镀膜下的气泡。

公开(公告)号：US4378384A

公开(公告)日：1983-03-29

申请号：US297565

申请日：1981-08-31

申请人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

发明人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

IPC分类号： H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  C23C3/02

CPC分类号： H05K3/381 ,  H05K3/387 ,  H05K2203/0793 ,  H05K2203/122 ,  H05K3/181 ,  H05K3/184 ,  H05K3/426

摘要： A process for producing a printed circuit board which comprises forming a plating film forming adhesive layer on the whole exposed surface of an insulating board, roughening said adhesive layer surface, depositing a catalyst for electroless copper plating on said adhesive layer surface from a catalyst solution, masking the thus treated insulating board surface excepting the part where a circuit is to be formed, and then performing the electroless copper plating on the catalyst of the board to form a circuit thereon, wherein an improvement comprises treating the roughened adhesive layer surface with an alkaline solution before depositing the catalyst thereon and treating the masked insulating board with an aqueous solution containing a surfactant before performing the electroless copper plating. The above process assures a higher copper utilization and a large adhesive strength of the copper plating to the board.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的整个暴露表面上形成镀膜形成粘合剂层，使所述粘合剂层表面粗糙化，在所述粘合剂层表面上从催化剂溶液沉积无电镀铜催化剂， 掩蔽除了形成电路的部分之外的如此处理的绝缘板表面，然后在板的催化剂上进行无电镀铜以在其上形成电路，其中改进包括用碱性处理粗糙化的粘合剂层表面 在将催化剂沉积在其上并在进行化学镀铜之前用含有表面活性剂的水溶液处理掩蔽的绝缘板。 上述方法确保了铜的铜利用率和电镀铜的较大的粘合强度。

公开(公告)号：US4610910A

公开(公告)日：1986-09-09

申请号：US655426

申请日：1984-09-28

申请人： Mineo Kawamoto ,  Kanji Murakami ,  Haruo Akahoshi ,  Yoichi Matsuda ,  Motoyo Wajima ,  Makoto Matsunaga ,  Shoji Kawakubo ,  Toyofusa Yoshimura ,  Haruo Suzuki ,  Tomio Yoshida

发明人： Mineo Kawamoto ,  Kanji Murakami ,  Haruo Akahoshi ,  Yoichi Matsuda ,  Motoyo Wajima ,  Makoto Matsunaga ,  Shoji Kawakubo ,  Toyofusa Yoshimura ,  Haruo Suzuki ,  Tomio Yoshida

IPC分类号： H05K3/42 ,  C23C18/16 ,  H05K3/18 ,  C23C18/28

CPC分类号： H05K3/184 ,  C23C18/1605 ,  C23C18/285 ,  C23C18/30 ,  C23C18/24 ,  C23C18/405 ,  H05K2203/0713 ,  H05K2203/1407 ,  Y10S428/901 ,  Y10T428/24917

摘要： A printed circuit board comprising an insulating board deposited with a catalyst having reactivity against electroless plating deposition, a resist for electroless plating provided on the insulating board excepting the part where a circuit is to be formed and a circuit formed by electroless plating, wherein the resist for electroless plating contains a coupling agent having a function of preventing the catalyst from ionizing. A process for producing the printed circuit board in which the insulating board surface excepting the part where a circuit is to be formed is covered with a resist for electroless plating containing a coupling agent having a function of preventing the catalyst from ionizing. Use of said resist for electroless plating can prevent drop of insulation resistance of the insulating board after moisture absorption.

摘要翻译： 一种印刷电路板，包括沉积有具有反电化学沉积反应性的催化剂的绝缘板，设置在除了要形成电路的部分之外的绝缘板上的无电电镀抗蚀剂和通过无电镀形成的电路，其中抗蚀剂 化学镀含有具有防止催化剂离子化的功能的偶联剂。 制造印刷电路板的方法，其中除了要形成电路的部分之外的绝缘板表面被含有具有防止催化剂离子化的功能的偶联剂的无电镀的抗蚀剂覆盖。 使用所述抗蚀剂进行化学镀可以防止绝缘板在吸湿后的绝缘电阻下降。

公开(公告)号：US4604160A

公开(公告)日：1986-08-05

申请号：US689802

申请日：1985-01-08

申请人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

发明人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

IPC分类号： H01F41/04 ,  H05K1/00 ,  H05K1/16 ,  H05K3/20 ,  C23F1/02 ,  B05D5/12 ,  B44C1/22 ,  C25D5/02

CPC分类号： H05K1/165 ,  H01F41/042 ,  H05K3/205 ,  H01L2221/68345 ,  H05K1/0393 ,  H05K2201/09881 ,  H05K2203/0152 ,  H05K2203/0726 ,  Y10T29/49155

摘要： This invention concerns a method for the manufacture of a printed wiring board which particularly proves useful as a printed coil. This method is characterized by the fact that in the work in process which has undergone the step for formation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon.Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.

摘要翻译： 本发明涉及一种特别证明可用作印刷线圈的印刷线路板的制造方法。 该方法的特征在于，在已经经历了形成导体电路的步骤的工作中，没有经历电镀抗蚀剂分离的步骤，电镀抗蚀剂和其它绝缘底材分离用于转印 从其上形成有导体电路的基板的表面。 由于该方法可以形成非常薄的绝缘层和比绝缘层更厚的导体电路层，所以能够在部件层表面和方向上制造非常薄的印刷线路板和具有高电路密度的印刷线圈 的组件层的叠加。

公开(公告)号：US4876177A

公开(公告)日：1989-10-24

申请号：US95921

申请日：1987-09-08

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Toyofusa Yoshimura

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Toyofusa Yoshimura

IPC分类号： C23C18/38 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38

CPC分类号： H05K3/184 ,  H05K2203/1407 ,  H05K3/0023 ,  H05K3/387

摘要： A process for producing a printed circuit board, which comprises the steps of forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist on the areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said resist. According to this invention, it is possible to provide a printed circuit board of higher reliability compared with conventional processes.

摘要翻译： 一种制造印刷电路板的方法，包括以下步骤：在绝缘基材上形成包含感光性树脂组合物的层，其表面上附着有金属的粘合剂层，随后在其上镀覆; 将包含光敏树脂组合物的所述层以使其在所述层上形成导体电路图案的负型图案并将所述负型图案半形成足以使其免受电镀溶液侵蚀的程度使光敏树脂组合物暴露于光化辐射; 通过用溶剂除去未暴露于所述光化辐射的未固化区域，从而在所述负型图案的区域上形成电镀抗蚀剂; 对未被所述电镀抗蚀剂覆盖的所述导体电路图案化学电镀，从而形成导体电路; 并进行固化处理以完全固化所述抗蚀剂。 根据本发明，与传统工艺相比，可以提供具有更高可靠性的印刷电路板。

公开(公告)号：US4865888A

公开(公告)日：1989-09-12

申请号：US206041

申请日：1988-06-13

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Akio Takokoro ,  Ritsuji Toba ,  Toyofusa Yoshimura

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Akio Takokoro ,  Ritsuji Toba ,  Toyofusa Yoshimura

IPC分类号： C23C18/16 ,  C23C18/40 ,  H05K3/18

CPC分类号： C23C18/1619 ,  C23C18/1669 ,  C23C18/40 ,  H05K3/187

摘要： An electroless copper plating process for producing fine patterned wiring boards is improved by supplying very fine oxygen-containing gas bubbles through a porous alkali-resistant resin gas dispersing tube. An electroless copper plating apparatus having such a gas dispersing tube is also provided.

摘要翻译： 通过提供非常细的含氧气泡通过多孔耐碱树脂气体分散管来改善用于制造精细图案化布线板的无电镀铜工艺。 还提供了一种具有这种气体分散管的化学镀铜装置。

公开(公告)号：US5356698A

公开(公告)日：1994-10-18

申请号：US705

申请日：1993-01-05

申请人： Mineo Kawamoto ,  Haruo Akahoshi ,  Akio Takahashi ,  Akio Mukoh ,  Kazuo Tanje ,  Toyofusa Yoshimura ,  Tokihito Suwa ,  Iwao Kaminaga ,  Toshiyuki Chida

发明人： Mineo Kawamoto ,  Haruo Akahoshi ,  Akio Takahashi ,  Akio Mukoh ,  Kazuo Tanje ,  Toyofusa Yoshimura ,  Tokihito Suwa ,  Iwao Kaminaga ,  Toshiyuki Chida

IPC分类号： C08K3/22 ,  H01B3/28 ,  H01B3/36 ,  H01B3/40 ,  H05K3/18 ,  H05K3/38 ,  B32B9/00

CPC分类号： C08K3/22 ,  H01B3/28 ,  H01B3/36 ,  H01B3/40 ,  H05K3/387 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K3/181 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/2852

摘要： Adhesive agent for substrate of electroless plating characterized in comprising epoxy resin, synthetic rubber, and phenolic resin as main components, a hardener of the epoxy resin, inorganic filler having hydroxyl group, and solvent.The adhesive agent is hardened at relatively low temperature (about 150.degree. C.) in short period (within 30 minutes) without giving warp and distortion to the insulation substrate, and moreover its insulation resistance after hardening is high.The adhesive agent is preferable as an adhesive agent for a printed circuit board.

摘要翻译： 化学镀基材用粘合剂，其特征在于包括环氧树脂，合成橡胶和酚醛树脂作为主要成分，环氧树脂的固化剂，具有羟基的无机填料和溶剂。 粘合剂在短时间内（30分钟内）在相对较低的温度（约150℃）下硬化，而不会对绝缘基材产生翘曲和变形，此外，其硬化后的绝缘电阻高。 优选粘合剂作为印刷电路板的粘合剂。

公开(公告)号：US4324629A

公开(公告)日：1982-04-13

申请号：US160201

申请日：1980-06-17

申请人： Hitoshi Oka ,  Hiroshi Kikuchi ,  Hitoshi Yokono ,  Haruo Suzuki ,  Toyofusa Yoshimura ,  Akira Matsuo ,  Osamu Miyazawa ,  Isamu Tanaka ,  Tokio Isogai

发明人： Hitoshi Oka ,  Hiroshi Kikuchi ,  Hitoshi Yokono ,  Haruo Suzuki ,  Toyofusa Yoshimura ,  Akira Matsuo ,  Osamu Miyazawa ,  Isamu Tanaka ,  Tokio Isogai

IPC分类号： C23C18/16 ,  C23C18/31 ,  C23G1/36 ,  C25D21/16 ,  B01D13/02

CPC分类号： B01D61/44 ,  C23C18/1617 ,  B01D2311/04 ,  Y10S204/13

摘要： During recyclic use of a chemical copper plating solution, counter anions to copper ions, anions formed by oxidation of a reducing agent, and carbon dioxide by absorption of carbon dioxide from air, which all have an inhibiting effect upon the plating, and also sodium ions having no inhibiting effect are accumulated in the plating solution.These accumulated ions can be removed by electrodialysis. Particularly, regeneration can be satisfactorily regenerated by adjusting the pH of used chemical plating solution to 2-11 before the electrodialysis, and using a selectively monovalent anion permeable membrane as an anion exchange membrane at the electrodialysis.

摘要翻译： 在循环使用化学镀铜溶液时，与铜离子相反的阴离子，通过还原剂的氧化形成的阴离子，以及二氧化碳从空气中吸收二氧化碳，这些都对电镀具有抑制作用，还有钠离子 在电镀溶液中没有积累抑制作用。 这些积聚的离子可以通过电渗析去除。 特别地，通过在电渗析之前将所使用的化学镀溶液的pH调节至2-11，并且在电渗析中使用选择性的单价阴离子可渗透膜作为阴离子交换膜，可以令人满意地再生。