公开(公告)号：US4610910A

公开(公告)日：1986-09-09

申请号：US655426

申请日：1984-09-28

申请人： Mineo Kawamoto ,  Kanji Murakami ,  Haruo Akahoshi ,  Yoichi Matsuda ,  Motoyo Wajima ,  Makoto Matsunaga ,  Shoji Kawakubo ,  Toyofusa Yoshimura ,  Haruo Suzuki ,  Tomio Yoshida

发明人： Mineo Kawamoto ,  Kanji Murakami ,  Haruo Akahoshi ,  Yoichi Matsuda ,  Motoyo Wajima ,  Makoto Matsunaga ,  Shoji Kawakubo ,  Toyofusa Yoshimura ,  Haruo Suzuki ,  Tomio Yoshida

IPC分类号： H05K3/42 ,  C23C18/16 ,  H05K3/18 ,  C23C18/28

CPC分类号： H05K3/184 ,  C23C18/1605 ,  C23C18/285 ,  C23C18/30 ,  C23C18/24 ,  C23C18/405 ,  H05K2203/0713 ,  H05K2203/1407 ,  Y10S428/901 ,  Y10T428/24917

摘要： A printed circuit board comprising an insulating board deposited with a catalyst having reactivity against electroless plating deposition, a resist for electroless plating provided on the insulating board excepting the part where a circuit is to be formed and a circuit formed by electroless plating, wherein the resist for electroless plating contains a coupling agent having a function of preventing the catalyst from ionizing. A process for producing the printed circuit board in which the insulating board surface excepting the part where a circuit is to be formed is covered with a resist for electroless plating containing a coupling agent having a function of preventing the catalyst from ionizing. Use of said resist for electroless plating can prevent drop of insulation resistance of the insulating board after moisture absorption.

摘要翻译： 一种印刷电路板，包括沉积有具有反电化学沉积反应性的催化剂的绝缘板，设置在除了要形成电路的部分之外的绝缘板上的无电电镀抗蚀剂和通过无电镀形成的电路，其中抗蚀剂 化学镀含有具有防止催化剂离子化的功能的偶联剂。 制造印刷电路板的方法，其中除了要形成电路的部分之外的绝缘板表面被含有具有防止催化剂离子化的功能的偶联剂的无电镀的抗蚀剂覆盖。 使用所述抗蚀剂进行化学镀可以防止绝缘板在吸湿后的绝缘电阻下降。

公开(公告)号：US4457952A

公开(公告)日：1984-07-03

申请号：US485399

申请日：1983-04-15

申请人： Mineo Kawamoto ,  Kanji Murakami ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita ,  Shoji Kawakubo ,  Toyofusa Yoshimura

发明人： Mineo Kawamoto ,  Kanji Murakami ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita ,  Shoji Kawakubo ,  Toyofusa Yoshimura

IPC分类号： H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02

CPC分类号： H05K3/181 ,  H05K3/184 ,  H05K3/387 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2203/0773 ,  H05K2203/1407

摘要： When an alkaline earth metal carbonate powder is mixed with an adhesive and is formed into an adhesive layer in a conventional covering method, a problem of the transfer of catalyst for electroless plating during a masking step or later electroless plating step is solved. Further, blisters under plated film caused by a fire retardant contained in an insulating substrate is also overcome by the use of alkaline earth metal powder.

摘要翻译： 当将碱土金属碳酸盐粉末与粘合剂混合并且以常规的覆盖方法形成粘合剂层时，解决了在掩蔽步骤或稍后的无电解电镀步骤期间用于化学镀的催化剂的转移的问题。 此外，通过使用碱土金属粉末也克服了由绝缘基板中包含的阻燃剂引起的电镀膜下的气泡。

公开(公告)号：US4378384A

公开(公告)日：1983-03-29

申请号：US297565

申请日：1981-08-31

申请人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

发明人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

IPC分类号： H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  C23C3/02

CPC分类号： H05K3/381 ,  H05K3/387 ,  H05K2203/0793 ,  H05K2203/122 ,  H05K3/181 ,  H05K3/184 ,  H05K3/426

摘要： A process for producing a printed circuit board which comprises forming a plating film forming adhesive layer on the whole exposed surface of an insulating board, roughening said adhesive layer surface, depositing a catalyst for electroless copper plating on said adhesive layer surface from a catalyst solution, masking the thus treated insulating board surface excepting the part where a circuit is to be formed, and then performing the electroless copper plating on the catalyst of the board to form a circuit thereon, wherein an improvement comprises treating the roughened adhesive layer surface with an alkaline solution before depositing the catalyst thereon and treating the masked insulating board with an aqueous solution containing a surfactant before performing the electroless copper plating. The above process assures a higher copper utilization and a large adhesive strength of the copper plating to the board.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的整个暴露表面上形成镀膜形成粘合剂层，使所述粘合剂层表面粗糙化，在所述粘合剂层表面上从催化剂溶液沉积无电镀铜催化剂， 掩蔽除了形成电路的部分之外的如此处理的绝缘板表面，然后在板的催化剂上进行无电镀铜以在其上形成电路，其中改进包括用碱性处理粗糙化的粘合剂层表面 在将催化剂沉积在其上并在进行化学镀铜之前用含有表面活性剂的水溶液处理掩蔽的绝缘板。 上述方法确保了铜的铜利用率和电镀铜的较大的粘合强度。

公开(公告)号：US4632852A

公开(公告)日：1986-12-30

申请号：US746099

申请日：1985-06-18

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

IPC分类号： C23C18/40 ,  H05K3/18 ,  C23C3/02

CPC分类号： H05K3/187 ,  C23C18/40

摘要： In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.

摘要翻译： 在含有铜盐，铜盐络合剂，铜盐还原剂和pH调节剂的化学镀铜溶液中的无电镀铜方法中，具有显着的机械性能的镀膜可以是 通过添加可溶性无机硅化合物和可溶性无机锗化合物中的至少一种而进行无电镀铜，通过将含氧气体注入镀液中或者通过向镀液中添加氧化剂，或者通过注入或氧气 并且向其中加入氧化剂。 可以更好地保持化学镀铜溶液的稳定性，并且可以实现基本上厚的镀覆。