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    Process for producing printed circuit board by electroless plating
    2.
    发明授权
    Process for producing printed circuit board by electroless plating 失效
    通过化学镀制造印刷电路板的工艺

    公开(公告)号：US4378384A

    公开(公告)日：1983-03-29

    申请号：US297565

    申请日：1981-08-31

    申请人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

    发明人： Kanji Murakami ,  Mineo Kawamoto ,  Yutaka Itoh ,  Youichi Matsuda ,  Motoyo Wajima ,  Shoji Kawakubo ,  Toyofusa Yoshimura

    IPC分类号： H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  C23C3/02

    CPC分类号： H05K3/381 ,  H05K3/387 ,  H05K2203/0793 ,  H05K2203/122 ,  H05K3/181 ,  H05K3/184 ,  H05K3/426

    摘要： A process for producing a printed circuit board which comprises forming a plating film forming adhesive layer on the whole exposed surface of an insulating board, roughening said adhesive layer surface, depositing a catalyst for electroless copper plating on said adhesive layer surface from a catalyst solution, masking the thus treated insulating board surface excepting the part where a circuit is to be formed, and then performing the electroless copper plating on the catalyst of the board to form a circuit thereon, wherein an improvement comprises treating the roughened adhesive layer surface with an alkaline solution before depositing the catalyst thereon and treating the masked insulating board with an aqueous solution containing a surfactant before performing the electroless copper plating. The above process assures a higher copper utilization and a large adhesive strength of the copper plating to the board.

    摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的整个暴露表面上形成镀膜形成粘合剂层，使所述粘合剂层表面粗糙化，在所述粘合剂层表面上从催化剂溶液沉积无电镀铜催化剂， 掩蔽除了形成电路的部分之外的如此处理的绝缘板表面，然后在板的催化剂上进行无电镀铜以在其上形成电路，其中改进包括用碱性处理粗糙化的粘合剂层表面 在将催化剂沉积在其上并在进行化学镀铜之前用含有表面活性剂的水溶液处理掩蔽的绝缘板。 上述方法确保了铜的铜利用率和电镀铜的较大的粘合强度。

    Process for forming printed wiring by electroless deposition
    6.
    发明授权
    Process for forming printed wiring by electroless deposition 失效
    通过无电沉积形成印刷线路的工艺

    公开(公告)号：US4239813A

    公开(公告)日：1980-12-16

    申请号：US33218

    申请日：1979-04-25

    申请人： Kanji Murakami ,  Mineo Kawamoto ,  Yoichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita

    发明人： Kanji Murakami ,  Mineo Kawamoto ,  Yoichi Matsuda ,  Motoyo Wajima ,  Hirosada Morishita

    IPC分类号： C23C18/16 ,  H05K3/18 ,  C23C3/02 ,  H01B5/14

    CPC分类号： H05K3/185 ,  C23C18/1605

    摘要： Highly precise wiring formed on an insulating substrate can be obtained by electroless deposition without using a printing process. Said process is characterized by forming an adhesive layer containing a photo-setting substance on a substrate, exposing the adhesive layer to actinic light imagewisely so as to irradiate only portions other than those forming wiring, treating the surface of the substrate with a roughening solution so as to roughen the portions not exposed to actinic light, and subjecting to the conventional treatments for electroless deposition so as to form prescribed wiring on the portions not exposed to actinic light.

    摘要翻译： 在绝缘基板上形成的高精度布线可以通过无电沉积而不使用印刷工艺获得。 所述方法的特征在于，在基材上形成含有光固化物质的粘合剂层，将粘合剂层成像曝光于光化反射光，以仅照射形成布线的部分以外的部分，以粗糙化溶液处理基材表面 以使不暴露于光化光的部分粗糙化，并进行常规的无电沉积处理，以便在不暴露于光化的光的部分上形成规定的布线。

    Electroless copper solution
    7.
    发明授权
    Electroless copper solution 失效
    无电解铜溶液

    公开(公告)号：US4099974A

    公开(公告)日：1978-07-11

    申请号：US665708

    申请日：1976-03-10

    申请人： Hirosada Morishita ,  Mineo Kawamoto ,  Motoyo Wajima ,  Kanji Murakami

    发明人： Hirosada Morishita ,  Mineo Kawamoto ,  Motoyo Wajima ,  Kanji Murakami

    IPC分类号： H05K3/18 ,  C23C18/40 ,  C23C3/02

    CPC分类号： C23C18/405

    摘要： An electroless copper solution capable of forming an electroless deposited copper film having as a higher elongation as that of electro deposited copper film is provided, which is characterized by adding either 2,2'-dipyridyl or 2,9-dimethyl-1,10-phenanthroline, and polyethylene glycol to the well known electroless copper solution containing a copper salt, such as cupric sulfate, a complexing agent such as ethylenediaminetetraacetic acid, a reducing agent such as formalin, and a pH-adjusting agent such as alkali hydroxide as main components.The present copper solution can provide not only a higher elongation of deposited film, but also higher depositing rate, about 3 - 4 .mu.m/hr, which is equal or superior to that of the conventional art.

    摘要翻译： 提供能够形成具有比电沉积铜膜高的伸长率的无电沉积铜膜的无电解铜溶液，其特征在于加入2,2'-二吡啶基或2,9-二甲基-1,10- 菲咯啉和聚乙二醇与众所周知的含有铜盐的化学镀铜溶液如硫酸铜，络合剂如乙二胺四乙酸，还原剂如福尔马林以及pH调节剂如碱金属氢氧化物作为主要成分 。

    Process for electroless copper plating
    8.
    发明授权
    Process for electroless copper plating 失效
    化学镀铜工艺

    公开(公告)号：US4632852A

    公开(公告)日：1986-12-30

    申请号：US746099

    申请日：1985-06-18

    申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

    发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

    IPC分类号： C23C18/40 ,  H05K3/18 ,  C23C3/02

    CPC分类号： H05K3/187 ,  C23C18/40

    摘要： In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.

    摘要翻译： 在含有铜盐，铜盐络合剂，铜盐还原剂和pH调节剂的化学镀铜溶液中的无电镀铜方法中，具有显着的机械性能的镀膜可以是 通过添加可溶性无机硅化合物和可溶性无机锗化合物中的至少一种而进行无电镀铜，通过将含氧气体注入镀液中或者通过向镀液中添加氧化剂，或者通过注入或氧气 并且向其中加入氧化剂。 可以更好地保持化学镀铜溶液的稳定性，并且可以实现基本上厚的镀覆。

    Bismide-ether compounds, compositions thereof, and method of producing same
    9.
    发明授权
    Bismide-ether compounds, compositions thereof, and method of producing same 失效
    二苯醚类化合物及其组合物及其制备方法

    公开(公告)号：US4296219A

    公开(公告)日：1981-10-20

    申请号：US5233

    申请日：1979-01-22

    申请人： Akio Takahashi ,  Yutaka Itoh ,  Motoyo Wajima ,  Hirosada Morishita ,  Akio Nishikawa

    发明人： Akio Takahashi ,  Yutaka Itoh ,  Motoyo Wajima ,  Hirosada Morishita ,  Akio Nishikawa

    IPC分类号： C07D207/44 ,  C07D207/448 ,  C08G73/12

    CPC分类号： C07D207/448 ,  C08G73/121

    摘要： A bisimide-ether compound having the general formula is obtained by reacting an ethylenically unsaturated dicarboxylic acid anhydride, a diamine compound and a phenolic compound having in the molecule at least two hydroxyl groups, or by reacting a prepolymer of the anhydride and diamine compound with the phenolic compound: ##STR1## wherein R.sub.1 is a group containing at least two carbon atoms, R.sub.2 is a group containing at least two carbon atoms, R'.sub.2 is a group containing at least two carbon atoms and a carbon-carbon double bond, R.sub.3 is an aromatic group, the nitrogen atoms of the imide rings being directly connected to different carbon atoms of the group R.sub.1, the carbonyl groups of the imide rings being directly connected to different carbon atoms of the group R.sub.2 or R'.sub.2, the oxygen atoms between the groups R.sub.2 and R.sub.3 being directly connected to an aromatic nucleus of the group R.sub.3, and n is an integer of zero, one or more than 1.

    摘要翻译： 通过使烯键式不饱和二羧酸酐，二胺化合物和分子中至少两个羟基的酚类化合物反应，或者使酸酐与二胺化合物的预聚物与 酚类化合物：其中R1是含有至少两个碳原子的基团，R2是含有至少两个碳原子的基团，R'2是含有至少两个碳原子的基团和碳 - 碳双键，R3 是芳族基团，酰亚胺环的氮原子直接连接到基团R1的不同碳原子上，酰亚胺环的羰基直接连接到基团R 2或R'2的不同碳原子上，氧原子 在基团R 2和R 3直接连接到基团R 3的芳香环上，且n是0，1或1以上的整数。