Articles such as miniature laser chips (15) are individually removed from an array on an adhesive web (20). A subjacent forming die has a planar, central surface (160) containing a vacuum cavity (120) and peripheral sloping surfaces (162). The web (20) has an adhesive side for holding the chips (15) and a smooth side for conforming to surfaces (160) and (162) of die (116). A leading target chip (15) is located centrally of cavity (120) on a planar portion of web (20) which portion is substantially restrained from movement away from die (116) by vacuum drawn in cavity (120). At the smooth side of web (20), within cavity (120), there is a needle (135) which is movable perpendicularly of and through web (20) along a path containing the target chip (15). At the adhesive side of web (20), opposite needle (135), there is a pickup probe (147) having a vacuum port (166 ) to retain a chip (15). Also, probe (147) is movable relative to and with a target chip (15) and the needle (135). Conveniently, probe (147) is registered with and forces a chip (15) into web (20) to reflect light and confirm contact. Then subjacent needle (135) is advanced to contact the same chip (15) from the smooth side of web (20). In synchronization, the probe (147) and needle (135) are then moved, with the chip (15) held therebetween, at least until the chip (15) is separated from web (20).