发明授权
- 专利标题： Method of through-contacting a circuit board
- 专利标题（中）： 通过电路板接触的方法
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申请号： US518795申请日： 1983-06-23
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公开(公告)号： US4485129A公开(公告)日： 1984-11-27
- 发明人: Werner Grunwald , Kurt Schmid
- 申请人： Werner Grunwald , Kurt Schmid
- 申请人地址： DEX Stuttgart
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： DEX Stuttgart
- 优先权： DEX3145584 19811117
- 主分类号： H05K3/12
- IPC分类号： H05K3/12 ; H05K3/40 ; H05K3/42 ; B05D5/12 ; B05C1/00
摘要：
A method is proposed for through-contacting a circuit board (17), in which the wall (15) of a bore (16) is provided with a metallizing of a conductive thick-film paste (12). The application of the metallizing is effected in a particularly advantageous manner by imprinting the electrically conductive paste (12) by means of an elastically deformable imprinting stamp (11, 12).
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